In situ enhanced bioremediation of dichlorvos by a phyllosphere Flavobacterium strain
In situ enhanced bioremediation of dichlorvos by a phyllosphere Flavobacterium strain
复制标题
叶圈黄杆菌菌株对敌敌畏的原位强化生物修复
DOI：
10.1007/s11783-011-0316-4
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发表时间：
2012-04
期刊：
影响因子：
--
通讯作者：
Zhuang, Guoqiang
中科院分区：
文献类型：
--
作者：
Qi, Hongyan;Ma, Anzhou;Zhuan, Xuliang;Zhuang, Guoqiang
从油菜层球中分离到一株能降解敌敌畏的细菌，命名为YD4。根据该菌株的表型特征和16S rRNA基因序列鉴定为黄杆菌。菌株YD4能够利用敌敌畏作为磷的唯一来源。对YD4对敌敌畏的原位强化生物修复进行了研究。作为唯一的磷源，该菌株也能降解毒死蜱和辛硫磷。油菜叶片表面喷施YD4后，敌敌畏的降解率高于经YD4灭菌和水处理的样品。结果表明，从土壤和水体中分离出的其他农药降解菌不适宜生存的环境中，附生降解菌可能成为原位层圈生物修复的新途径。
A bacterium capable of degrading dichlorvos was isolated from the rape phyllosphere and designated YD4. The strain was identified as Flavobacterium sp., based on its phenotypic features and 16S rRNA gene sequence. Strain YD4 was able to utilize dichlorvos as the sole source of phosphorus. In situ enhanced bioremediation of dichlorvos by YD4 was hereafter studied. Chlorpyrifos and phoxim could also be degraded by this strain as the sole phosphorus source. A higher degradation rate of dichlorvos was observed after spraying YD4 onto the surface of rape leaves when compared to the sterilized-YD4 and water-treated samples. The results indicated that pesticide-degrading epiphytic bacterium could become a new way for in situ phyllosphere bioremediation where the hostile niche is unsuitable for other pesticide-degrading bacteria isolated from soil and water.
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影响因子：
4.4
作者：
Horne, I;Sutherland, TD;Oakeshott, JG
通讯作者：
Oakeshott, JG
影响因子：
2.1
作者：
Baoguo Zhang;Z. Bai;D. Hoefel;L. Tang;Zhiguang Yang;G. Zhuang;Jianzhou Yang;Hongxun Zhang
通讯作者：
Baoguo Zhang;Z. Bai;D. Hoefel;L. Tang;Zhiguang Yang;G. Zhuang;Jianzhou Yang;Hongxun Zhang
影响因子：
13.6
作者：
A. R. Kulkarni;K. Soppimath;A.M Dave;M.H Mehta;T. Aminabhavi
通讯作者：
A. R. Kulkarni;K. Soppimath;A.M Dave;M.H Mehta;T. Aminabhavi
影响因子：
4.4
作者：
D. Siddavattam;S. Khajamohiddin;B. Manavathi;S. Pakala;M. Merrick
通讯作者：
D. Siddavattam;S. Khajamohiddin;B. Manavathi;S. Pakala;M. Merrick
影响因子：
5.1
作者：
J. Holt;N. Krieg;P. Sneath;J. T. Staley;S. Williams
通讯作者：
J. Holt;N. Krieg;P. Sneath;J. T. Staley;S. Williams