An equivalent temperature model of 3-D steady heat conduction analysis for a fiber metal laminated plate coated with a thermal barrier
An equivalent temperature model of 3-D steady heat conduction analysis for a fiber metal laminated plate coated with a thermal barrier
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涂有热障的纤维金属层合板的三维稳态热传导分析的等效温度模型
DOI：
10.2298/tsci190704445g
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发表时间：
2019
期刊：
影响因子：
1.7
通讯作者：
Hao-Jie Jiang
中科院分区：
文献类型：
--
作者：
Ning-Hua Gao;Jun-Wei Lian;Zhao-Hui Xu;Hao-Jie Jiang
本文提出了一种复合材料层合板三维稳态热传导分析的等效温度模型。首次综合应用分离变量法和等效温度法求解了纤维金属层合板（FML）结构热障层与顶层铝2024-T3界面处的温度场，根据上下两层相邻层间热流平衡原理，计算出其它层的温度和接触热阻随后。研究了CFML结构中纤维种类、FML层数、CFML结构与热障的厚度比以及温度分布函数对CFML结构各相邻层间接触热阻和上下表面温度分布的影响。特别是，无论考虑一种或两种纤维种类，接触热阻的最大值与最小值之比都在5倍左右。此外，本文的研究结果（主要是几何和物理参数的影响）可以指导工程师设计CFML结构以适应高温环境，特别是航天温度环境。
In this paper, an equivalent temperature model of three-dimensional steady heat conduction analysis for a fiber metal laminated plate coated with a thermal barrier (CFML) is presented. The separate variable method (SVM) and equivalent temperature (ET) method are applied comprehensively to solve the temperature field at the interface between the thermal barrier and top aluminum 2024-T3 layer for the fiber metal laminated (FML) structure firstly, and values of other layers’ temperature and thermal contact resistance are obtained based on balance principle of heat flux between respective adjacent top and bottom layers subsequently. The aim of this research is to understand the influences of kinds of fiber species, numbers of FML layers, thickness ratio between total CFML structure and thermal barrier as well as temperature distributed function on the values of thermal contact resistance between respective adjacent layers and temperature distribution from top to bottom surfaces for the CFML structure. Especially, the ratio of thermal contact resistance between maximum and minimum values are about 5 times no matter considering one or two kinds of fiber species. Besides the present results (mainly geometrical and physical parameters’ effect) could guide engineers designing the CFML structures to adapt to high-temperature environment especially aerospace temperature environment.
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