A synthesis framework for stitching surface code with superconducting quantum devices
A synthesis framework for stitching surface code with superconducting quantum devices
复制标题
一种用超导量子器件拼接表面代码的综合框架
DOI:
10.1145/3470496.3527381
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发表时间:
2022
期刊:
影响因子:
--
通讯作者:
Xie, Yuan
中科院分区:
文献类型:
--
作者:
Wu, Anbang;Li, Gushu;Zhang, Hezi;Guerreschi, Gian Giacomo;Ding, Yufei;Xie, Yuan
Quantum error correction (QEC) is the central building block of fault-tolerant quantum computation but the design of QEC codes may not always match the underlying hardware. To tackle the discrepancy between the quantum hardware and QEC codes, we propose a synthesis framework that can implement and optimize the surface code onto superconducting quantum architectures. In particular, we divide the surface code synthesis into three key subroutines. The first two optimize the mapping of data qubits and ancillary qubits including syndrome qubits on the connectivity-constrained superconducting architecture, while the last subroutine optimizes the surface code execution by rescheduling syndrome measurements. Our experiments on mainstream superconducting architectures demonstrate the effectiveness of the proposed synthesis framework. Especially, the surface codes synthesized by the proposed automatic synthesis framework can achieve comparable or even better error correction capability than manually designed QEC codes.
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DOI:
10.1145/3466752.3480072
发表时间:
2021-10
期刊:
MICRO-54: 54th Annual IEEE/ACM International Symposium on Microarchitecture
影响因子:
--
作者:
Fei Hua;Yan-Hao Chen;Yuwei Jin;Chi Zhang;Ari B. Hayes;Youtao Zhang;E. Zhang
通讯作者:
Fei Hua;Yan-Hao Chen;Yuwei Jin;Chi Zhang;Ari B. Hayes;Youtao Zhang;E. Zhang
影响因子:
2.9
作者:
Calderbank, AR;Shor, PW
通讯作者:
Shor, PW
DOI:
10.1109/micro.2018.00072
发表时间:
2018-09
期刊:
2018 51st Annual IEEE/ACM International Symposium on Microarchitecture (MICRO)
影响因子:
--
作者:
Yongshan Ding;Adam Holmes;Ali JavadiAbhari;D. Franklin;M. Martonosi;F. Chong
通讯作者:
Yongshan Ding;Adam Holmes;Ali JavadiAbhari;D. Franklin;M. Martonosi;F. Chong
DOI:
10.1145/3400302.3415620
发表时间:
2020
期刊:
2020 IEEE/ACM International Conference On Computer Aided Design (ICCAD)
影响因子:
--
作者:
Daniel Bochen Tan;J. Cong
通讯作者:
J. Cong
影响因子:
5.7
作者:
Wang, Yazhen
通讯作者:
Wang, Yazhen