Numerical Investigation of Substrate Melting and Deformation During Thermal Spray Coating by SPH Method
Numerical Investigation of Substrate Melting and Deformation During Thermal Spray Coating by SPH Method
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SPH法热喷涂过程中基体熔化和变形的数值研究
DOI:
10.1007/s11090-008-9158-7
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发表时间:
2009-02
影响因子:
3.6
通讯作者:
Mingyu Zhang
中科院分区:
文献类型:
--
作者:
Lili Zheng;Hui Zhang;Mingyu Zhang
The fluid–solid coupling model is developed to simulate substrate melting and deformation during molten droplet impact. In this model, the liquid and solid parts of splat and substrate are governed by the SPH formulations of the Navier–Stokes equations an
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影响因子:
2.1
作者:
L. Li;X. Y. Wang;G. Wei;A. Vaidya;H. Zhang;S. Sampath
通讯作者:
L. Li;X. Y. Wang;G. Wei;A. Vaidya;H. Zhang;S. Sampath
DOI:
10.1016/s0017-9310(01)00336-2
发表时间:
2002-05
影响因子:
5.2
作者:
M. Pasandideh-Fard;S. Chandra;J. Mostaghimi
通讯作者:
M. Pasandideh-Fard;S. Chandra;J. Mostaghimi
影响因子:
2.4
作者:
Nugent, S;Posch, HA
通讯作者:
Posch, HA
DOI:
10.1016/s0921-5093(98)01026-0
发表时间:
1999-04
影响因子:
6.4
作者:
S. Wang;Gang Wang;E. Matthys
通讯作者:
S. Wang;Gang Wang;E. Matthys
DOI:
10.1016/s0017-9310(01)00109-0
发表时间:
2001-12
影响因子:
5.2
作者:
Hui Zhang;Xiaolin Wang;Lili Zheng;X. Jiang
通讯作者:
Hui Zhang;Xiaolin Wang;Lili Zheng;X. Jiang