Electrothermal feedback in kinetic inductance detectors
Electrothermal feedback in kinetic inductance detectors
复制标题
动感电感探测器中的电热反馈
DOI：
10.1088/1361-6668/aa68ab
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发表时间：
2017
影响因子：
3.6
通讯作者：
Guruswamy T
中科院分区：
文献类型：
--
作者：
Guruswamy T
在动态电感探测器（KIDs）和超导微谐振器的其他类似应用中，器件的大信号和小信号行为都可能受到电热反馈的影响。用于读出器件的微波功率被超导体准粒子吸收并加热，从而改变超导体的导电性，从而使读出功率在正反馈或负反馈回路中被吸收。在这项工作中，我们在数值上探讨了一个可扩展的理论模型对典型KID的通用超导微谐振器装置的影响，并结合了最近在超导准粒子和声子之间的功率流方面的工作。该模型计算了设备的大信号（工作点的变化）和小信号行为，使我们能够确定电热反馈在各种工作条件下对设备响应性和噪声特性的影响。我们还研究了如何将器件与镀液热隔离，例如通过将器件设计在仅通过细腿连接到主体基板的膜上，从而影响器件性能。我们发现，在一个典型的器件工作点，正电热反馈降低了超导体准粒子到电解槽的有效热导，从而增加了对信号（破对）功率的响应性，增加了温度波动引起的噪声，降低了噪声等效功率（NEP）。同样，在保持准粒子温度不变的情况下，增加器件的热隔离会降低NEP，但也会降低器件的响应带宽。
In kinetic inductance detectors (KIDs) and other similar applications of superconducting microresonators, both the large and small-signal behaviour of the device may be affected by electrothermal feedback. Microwave power applied to read out the device is absorbed by and heats the superconductor quasiparticles, changing the superconductor conductivity and hence the readout power absorbed in a positive or negative feedback loop. In this work, we explore numerically the implications of an extensible theoretical model of a generic superconducting microresonator device for a typical KID, incorporating recent work on the power flow between superconductor quasiparticles and phonons. This model calculates the large-signal (changes in operating point) and small-signal behaviour of a device, allowing us to determine the effect of electrothermal feedback on device responsivity and noise characteristics under various operating conditions. We also investigate how thermally isolating the device from the bath, for example by designing the device on a membrane only connected to the bulk substrate by thin legs, affects device performance. We find that at a typical device operating point, positive electrothermal feedback reduces the effective thermal conductance from the superconductor quasiparticles to the bath, and so increases responsivity to signal (pair-breaking) power, increases noise from temperature fluctuations, and decreases the noise equivalent power (NEP). Similarly, increasing the thermal isolation of the device while keeping the quasiparticle temperature constant decreases the NEP, but also decreases the device response bandwidth.
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