Surfactant-free synthesis of copper nanoparticles and gas phase integration in CNT-composite materials.

Surfactant-free synthesis of copper nanoparticles and gas phase integration in CNT-composite materials.
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DOI:
10.1039/d0na00922a
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发表时间:
2021-02-10
期刊:
影响因子:
4.7
通讯作者:
--
中科院分区:
材料科学3区
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--
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铜纳米颗粒(CuNPs)是替代块状铜或其他更昂贵的纳米颗粒(如金或银)的一种可行的低成本替代材料,用于电子电气接触材料或高导电性材料。本研究以固体铜前驱体为原料,利用Ar+H2微等离子体合成了分散良好的纳米铜纳米粒子。用电子显微镜进行了形态分析,显示了平均直径为8 nm的颗粒。用X射线衍射仪和X射线光电子能谱分别进行了结晶度和化学分析。在第二步中,成功地将铜纳米颗粒沉积到多孔碳纳米管带上;研究了铜纳米颗粒在碳纳米管带结构中的表面覆盖率和穿透深度,这将有助于许多应用。并详细研究了不同条件下纳米铜的氧化状态。常压等离子体无表面活性剂合成纳米铜。
Copper nanoparticles (Cu-NPs) represent a viable low-cost alternative to replace bulk copper or other more expensive NPs (e.g. gold or silver) in various applications such as electronics for electrical contact materials or high conductivity materials. This study deals with the synthesis of well dispersed Cu-NPs by using an Ar + H2 microplasma using a solid copper precursor. The morphological analysis is carried out by electron microscopy showing particles with a mean diameter of 8 nm. Crystallinity and chemical analyses were also carried out by X-ray diffraction and X-ray photoelectron spectroscopy, respectively. In the second step, the Cu-NPs were successfully deposited onto porous carbon nanotube ribbons; surface coverage and the penetration depth of the Cu-NPs inside the CNT ribbon structure were investigated as these can be beneficial for a number of applications. The oxidation state of the Cu-NPs was also studied in detail under different conditions. Surfactant free synthesis of copper nanoparticles by using atmospheric plasma pressure.
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