Experimental and numerical simulations of ELM-like transient damage behaviors to different grade tungsten and tungsten alloys
Experimental and numerical simulations of ELM-like transient damage behaviors to different grade tungsten and tungsten alloys
复制标题
不同牌号钨及钨合金类ELM瞬态损伤行为的实验和数值模拟
DOI：
10.1016/j.jnucmat.2014.12.114
复制
发表时间：
2015-08
影响因子：
3.1
通讯作者：
Jiming Chen
中科院分区：
文献类型：
--
作者：
Youyun Lian;Lei Chen;Zhenkui Chen;Jiming Chen
瞬态热载荷，如等离子体破裂和ELMs，可以诱导钨（W）表面的塑性变形，开裂，熔化，甚至疲劳裂纹和蠕变。在60 kW电子束装置上模拟不同基底温度下的瞬态载荷事件，对高纯W、CVD-W涂层、TiC弥散强化和K掺杂钨合金进行了试验。结果表明，CVD-W、W-TiC和W-K合金比高纯W具有更高的裂纹门槛值，且CVD-W对基体温度升高时裂纹消失更敏感。另一方面，重复脉冲加载，如ELMs可以诱发严重的网络裂纹，即使功率密度远低于裂纹门槛值由一个单一的射击。采用有限元分析软件FE-SAFE对ITER级纯W材料进行了疲劳寿命估算。与实验结果吻合较好。
Transient heat loads, such as plasma disruptions and ELMs, could induce plastic deformations, cracking, melting, even fatigue cracks and creep of tungsten (W) surface. A high purity W, CVD-W coating, TiC dispersion strengthened and K doped tungsten alloys were tested in a 60 kW electron-beam facility by simulating the transient load events under different base temperatures. It was found that CVD-W, W-TiC and W-K alloys have higher crack thresholds than high purity W, meanwhile CVD-W is more sensitive to the crack disappearing at elevated base temperatures. On the other hand, repetitive pulse loading like ELMs can induce serious network cracks even the power density was quite lower than the crack threshold determined by a single shot. The ABAQUS code was used to simulate the crack behaviors of ITER grade pure W by a single shot and a FE-SAFE code was adopted to estimate the fatigue life under ELMs-like loads. A good agreement with experiment results was found.
登录
查看更多内容
影响因子：
3.1
作者：
M. Wirtz;J. Linke;G. Pintsuk;G. D. Temmerman;G. Wright
通讯作者：
M. Wirtz;J. Linke;G. Pintsuk;G. D. Temmerman;G. Wright
影响因子：
3.1
作者：
Jiupeng Song;Yang Yu;Zhu Zhigang;Y. Lian;Xiang Liu;Y. Qi
通讯作者：
Jiupeng Song;Yang Yu;Zhu Zhigang;Y. Lian;Xiang Liu;Y. Qi
影响因子：
3.1
作者：
T. Loewenhoff;T. Hirai;S. Keusemann;J. Linke;G. Pintsuk;A. Schmidt
通讯作者：
T. Loewenhoff;T. Hirai;S. Keusemann;J. Linke;G. Pintsuk;A. Schmidt
影响因子：
3.1
作者：
K. Tokunaga;H. Kurishita;H. Arakawa;S. Matsuo;T. Hotta;K. Araki;Y. Miyamoto;T. Fujiwara;K. Nakamura;T. Takida;M. Kato;A. Ikegaya
通讯作者：
K. Tokunaga;H. Kurishita;H. Arakawa;S. Matsuo;T. Hotta;K. Araki;Y. Miyamoto;T. Fujiwara;K. Nakamura;T. Takida;M. Kato;A. Ikegaya
影响因子：
0.9
作者：
A. Huber;A. Burdakov;M. Zlobinski;M. Wirtz;J. Coenen;J. Linke;P. Mertens;V. Philipps;G. Pintsuk;B. Schweer;G. Sergienko;A. Shoshin;U. Samm;B. Unterberg
通讯作者：
A. Huber;A. Burdakov;M. Zlobinski;M. Wirtz;J. Coenen;J. Linke;P. Mertens;V. Philipps;G. Pintsuk;B. Schweer;G. Sergienko;A. Shoshin;U. Samm;B. Unterberg