Graphene-protected copper and silver plasmonics.
Graphene-protected copper and silver plasmonics.
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DOI：
10.1038/srep05517
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发表时间：
2014-07-01
影响因子：
4.6
通讯作者：
Grigorenko AN
中科院分区：
文献类型：
--
作者：
Kravets VG;Jalil R;Kim YJ;Ansell D;Aznakayeva DE;Thackray B;Britnell L;Belle BD;Withers F;Radko IP;Han Z;Bozhevolnyi SI;Novoselov KS;Geim AK;Grigorenko AN
等离子体激元已经成为物理学的一个分支，它有望给数据处理带来革命性的变化，改进光伏技术，提高生物探测的灵敏度。等离子体器件的广泛使用明显受到高损耗和缺乏适用于等离子体应用的稳定和廉价的金属薄膜的阻碍。为此，人们一直在不断地寻找与互补金属氧化物半导体技术兼容的替代等离子体材料。在这里，我们展示了由石墨烯保护的铜和银是可行的候选者。覆盖一层到几层石墨烯的铜膜表现出良好的等离子体特性。它们可以用来制造等离子设备，即使在潮湿和腐蚀的条件下也能存活至少一年。作为概念的验证，我们使用石墨烯保护的铜来演示介质加载的等离子体波导并测试表面等离子体共振的灵敏度。我们的结果可能会推动石墨烯保护的等离子体的广泛使用。
Plasmonics has established itself as a branch of physics which promises to revolutionize data processing, improve photovoltaics, and increase sensitivity of bio-detection. A widespread use of plasmonic devices is notably hindered by high losses and the absence of stable and inexpensive metal films suitable for plasmonic applications. To this end, there has been a continuous search for alternative plasmonic materials that are also compatible with complementary metal oxide semiconductor technology. Here we show that copper and silver protected by graphene are viable candidates. Copper films covered with one to a few graphene layers show excellent plasmonic characteristics. They can be used to fabricate plasmonic devices and survive for at least a year, even in wet and corroding conditions. As a proof of concept, we use the graphene-protected copper to demonstrate dielectric loaded plasmonic waveguides and test sensitivity of surface plasmon resonances. Our results are likely to initiate wide use of graphene-protected plasmonics.
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影响因子：
10.8
作者：
Koppens, Frank H. L.;Chang, Darrick E.;Javier Garcia de Abajo, F.
通讯作者：
Javier Garcia de Abajo, F.
影响因子：
1.9
作者：
GOLAN, Y;MARGULIS, L;RUBINSTEIN, I
通讯作者：
RUBINSTEIN, I
DOI：
10.1002/pssb.2221070207
发表时间：
1981-01-01
期刊：
PHYSICA STATUS SOLIDI B-BASIC RESEARCH
影响因子：
--
作者：
ROBUSTO, PF;BRAUNSTEIN, R
通讯作者：
BRAUNSTEIN, R
影响因子：
17.1
作者：
Schriver, Maria;Regan, William;Zettl, Alex
通讯作者：
Zettl, Alex
影响因子：
3.7
作者：
Jablan, Marinko;Buljan, Hrvoje;Soljacic, Marin
通讯作者：
Soljacic, Marin