Phase-sensitive optical coherence tomography for non-contact monitoring photocuring process
Phase-sensitive optical coherence tomography for non-contact monitoring photocuring process
复制标题
用于非接触式监测光固化过程的相敏光学相干断层扫描
DOI：
10.1088/1361-6501/ac0b6e
复制
发表时间：
2021
影响因子：
2.4
通讯作者：
Pan Bing
中科院分区：
文献类型：
--
作者：
Dong Bo;Bai Yulei;Xie Shengli;Pan Bing
最近提出了一种结合相位对比技术和谱域光学相干断层扫描（OCT）的方法，用于可视化聚合物内部的固化行为（2020 Appl. Phys. Lett. 116 054103）。在此基础上，进一步开发了一种非接触、高灵敏度的光传感器，用于监测光固化聚合物的光固化过程。与现有方法相比，该光学传感器具有两个明显的优点：（1）传感器采用点检测OCT而不是线场OCT来捕获干涉信号，显著提高了其实用性和测量速度;（B）传感器可同时监测光固化过程中的收缩应变和折射率变化，在实际应用中具有增强的功能。通过固化监测实验验证了该传感器能够准确监测聚合物光固化过程中的收缩应变和折射率变化。对聚合物涂层和聚合物粘接过程进行了监测，表明了传感器的有效性和实用性。
A method combining phase-contrast technique and spectral-domain optical coherence tomography (OCT) has been recently proposed for visualizing curing behaviors inside polymers (2020 Appl. Phys. Lett. 116 054103). Here, based on the method, a non-contact and highly-sensitive optical sensor is further developed to monitor the photocuring process of light-cured polymers. Compared with the existing method, the proposed optical sensor features two distinct advantages: (a) the sensor uses a point-detection OCT, rather than a line-field OCT, to capture the interference signal, which significantly improves its practicability and the measuring speed; (b) the sensor can simultaneously monitor the shrinkage strains and refractive index variations during a photocuring process, featuring enhanced functionality in practical applications. For validation, a cure monitoring experiment was carried out, proving that the sensor can accurately monitor the shrinkage strain and refractive index variation during the polymer photocuring process. The polymer coating fabrication process and the polymer adhesive process were also monitored, showing the effectiveness and practicability of the sensor.
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影响因子：
9.1
作者：
Antonucci, V.;Giordano, M.;Nicolais, L.
通讯作者：
Nicolais, L.
影响因子：
5.1
作者：
W. Stark;M. Jaunich;J. McHugh
通讯作者：
W. Stark;M. Jaunich;J. McHugh
影响因子：
5.1
作者：
W. Stark;M. Jaunich;J. McHugh
通讯作者：
W. Stark;M. Jaunich;J. McHugh
影响因子：
--
作者：
Bo Dong;B. Pan
通讯作者：
Bo Dong;B. Pan
影响因子：
4.6
作者：
Cusano, A;Breglio, G;Nicolais, L
通讯作者：
Nicolais, L