Accelerated wetting transition from hydrophilic to hydrophobic of sputtered Cu films with micro-scale patterns
Accelerated wetting transition from hydrophilic to hydrophobic of sputtered Cu films with micro-scale patterns
复制标题
具有微尺度图案的溅射铜膜从亲水性到疏水性的加速润湿转变
DOI：
10.1016/j.apsusc.2020.146741
复制
发表时间：
2020-10
影响因子：
6.7
通讯作者：
Xuefeng Zhang
中科院分区：
文献类型：
--
作者：
Dapeng Zhu;Zhen Shi;Xiangyang Tan;Jian Zhang;Shihong Zhang;Xuefeng Zhang
Hydrophobic surfaces have attracted increasing interest due to their versatile applications. Recently, hydrocarbon adsorption and its influence on the wettability has aroused great attention, some hydrophilic surfaces could turn into hydrophobic with gradual adsorption of organic compounds from ambient air. In this work, we demonstrated that micro-square holes can effectively accelerate and magnify the wetting transition, reducing the transition period of sputtered Cu films from hydrophilic to hydrophobic, finally, water droplet pinned tightly to the film surfaces. XPS results revealed that hydrocarbon adsorption caused an obvious increase in surface C content, which contributed further to the hydrophobicity enhancement and surface energy decrement over exposure time. To clearly explain the accelerated transition mechanism, we discussed extensively how the wetting on patterned Cu films evolved. Calculations according to the Wenzel and Cassie-Baxter theory showed that the final wetting state on patterned Cu films was in Cassie-Baxter regime and the holes were responsible for the observed transition. This study not only provides deep insights into the wetting transition mechanism of sputtered Cu films, but further guides how to effectively achieve stable hydrophobic surfaces with adhesive properties through rationally designed patterns.
登录
查看更多内容
影响因子：
6.7
作者：
Chun-Wei Yao;Sirui Tang;Divine Sebastian;R. Tadmor
通讯作者：
Chun-Wei Yao;Sirui Tang;Divine Sebastian;R. Tadmor
深入了解通过电沉积制备的金属表面的超疏水性，涉及空气中碳氢化合物的自发吸附
影响因子：
6.7
作者：
Liu, Peng;Cao, Ling;Li, Zelin
通讯作者：
Li, Zelin
DOI：
10.1021/j100888a035
发表时间：
1965-04
期刊：
The Journal of Physical Chemistry
影响因子：
--
作者：
R. Erb
通讯作者：
R. Erb
影响因子：
4.6
作者：
O. Peña-Rodríguez;C. F. Sánchez-Valdés;M. Garriga;M. Alonso;X. Obradors;T. Puig
通讯作者：
O. Peña-Rodríguez;C. F. Sánchez-Valdés;M. Garriga;M. Alonso;X. Obradors;T. Puig
影响因子：
15
作者：
Lim, Ho Sun;Han, Joong Tark;Cho, Kilwon
通讯作者：
Cho, Kilwon