Site-selective metallization of polymeric substrates by the hyperbranched polymer templates
Site-selective metallization of polymeric substrates by the hyperbranched polymer templates
复制标题
通过超支化聚合物模板对聚合物基材进行位点选择性金属化
DOI：
10.1016/j.apsusc.2013.04.117
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发表时间：
2013-09
期刊：
影响因子：
--
通讯作者：
Lifang Liang
中科院分区：
文献类型：
--
作者：
Lini Huo;Rui Chen;Chensheng Lu;Lifang Liang
We demonstrate a simple, cost-effective and universal technique for the fabrication of copper circuit pattern on flexible polymeric substrate. This method relies on a ternary polyethylenimine-poly(acrylic acid)-substrate film incorporating palladium catalysts, which are used as adhesive interlayers for the copper metallization of flexible polymeric substrates. We demonstrated the fabrication of patterned copper films on a variety of flexible polymers with minimum feature sizes of 200μm. And the resulting copper circuit showed strong adhesion with underlying flexible polymeric substrates. The films were characterized by ATR FT-IR, contact angle, XPS, XRD, TEM and SEM. The direct patterning of metallic circuit on flexible polymeric substrate indicates great potential for the use in electronics industry.
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