Evolution of the microstructure and solute distribution of Sn-10wt% Bi alloys during electromagnetic field-assisted directional solidification

Evolution of the microstructure and solute distribution of Sn-10wt% Bi alloys during electromagnetic field-assisted directional solidification
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演化%20of%20%20显微组织%20和%20溶质%20分布%20of%20Sn-10wt%%20Bi%20合金%20期间%20电磁%20场辅助%20定向%20凝固

DOI:
10.1016/j.jmst.2018.09.037
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发表时间:
2019-01
影响因子:
10.9
通讯作者:
Ren Zhongming
Ren Zhongming
中科院分区:
材料科学1区
文献类型:
--
作者:
Shen Zhe;Peng Minghu;Zhu Dongsheng;Zheng Tianxiang;Zhong Yunbo;Ren Weili;Li Chuanjun;Xuan Weidong;Ren Zhongming

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在同时施加横向静磁场(TSMF)和外部直流电(DC)的情况下,不同速度的强制流动对 Sn-10 wt% Bi 合金定向凝固过程中显微组织和溶质分布的影响进行了实验和数值研究。实验结果表明,当凝固前沿的强制流动以热电磁对流(TEMC)为主时,随着强制流动速度的增加,固液界面将逐渐变得倾斜。然而,当电磁对流(EMC)主导强制流动时,随着流速进一步增加,界面将逐渐变成平面。而且,当流速逐渐增大时,初生枝晶间距相应地从384μm减小到105μm。模拟结果表明,凝固前沿的强制流动可以显着改变样品两侧的溶质分布。被拒绝的溶质将沿着TEMC(低速强制流)单向输送到样品的一侧,从而形成倾斜界面。然而,被拒绝的溶质将沿着 EMC(高速力流)返回,从而形成平面界面。此外,还测量了在不同速度的强制流动下样品两侧的溶质含量。结果与模拟结果吻合较好,表明当施加0.5 T TSMF时,样品两侧的溶质含量差异达到最大,而同时施加0.5 T TSMF和1.6 x 10(5) A/m(2)外部DC时,溶质含量差异减小至零。 (C) 2019 由 Elsevier Ltd 代表《Journal of Materials Science & Technology》编辑部出版。
The effects of forced flows at different velocities on microstructure and solute distribution during the directional solidification of Sn-10 wt% Bi alloys under a simultaneous imposition of a transverse static magnetic field (TSMF) and an external direct current (DC) have been investigated experimentally and numerically. The experimental results show that the solid-liquid interface will gradually become sloping with the increase of the forced flow velocity when the thermoelectric magnetic convection (TEMC) dominates the forced flow at solidification front. However, the interface will gradually become planar as the flow velocity further increases when the electromagnetic convection (EMC) dominates the forced flow. Moreover, when the flow velocity gradually increases, the primary dendrite spacing decreases from 384 to 105 mu m accordingly. The simulation results show that the solute distribution at the two sides of the sample can be significantly changed by the forced flow at solidification front. The rejected solute will be unidirectionally transported to one side of the sample along the TEMC (a low-velocity forced flow), thereby causing the formation of a sloping interface. However, the rejected solute will be returned back along the EMC (a higher-velocity force flow), which results in a planar interface. Furthermore, the solute content at the two sides of the sample under the forced flows at different velocities was measured. The results are in good agreement with the simulation results, which shows that the solute content difference between the two sides of the sample reaches the maximum when a 0.5 T TSMF is applied, while the solute content difference decreases to zero with a simultaneous application of a 0.5 T TSMF and a 1.6 x 10(5) A/m(2) external DC. (C) 2019 Published by Elsevier Ltd on behalf of The editorial office of Journal of Materials Science & Technology.
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