Optimization of a multi-Constant Work-in-Process semiconductor assembly and test factory based on performance evaluation
Optimization of a multi-Constant Work-in-Process semiconductor assembly and test factory based on performance evaluation
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基于性能评估的多在制品半导体封装测试工厂优化
DOI：
10.1016/j.cie.2010.05.003
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发表时间：
2010-09
期刊：
影响因子：
--
通讯作者：
Li Na, Yao Shiqing, Liu George,Zhuang Caihua
中科院分区：
文献类型：
--
作者：
Li Na, Yao Shiqing, Liu George,Zhuang Caihua
本文研究了一个半导体组装测试工厂，该工厂是一个具有重叠机器的三段恒在制品（CONWIP）系统。在该系统中，有三种类型的小车循环以满足物理要求。从系统吞吐量和在制品水平之间的权衡角度出发，解决了在制品水平和在制品水平在三个循环中分布的优化问题。在该模型中，首先将系统建模为一个三环封闭队列网络，并提出了一种近似的性能评估方法。通过数值实验验证了评价方法的准确性，表明该方法具有较高的精度。其次，在性能评估的基础上，设计了一种近似最优的遗传算法。详细介绍了半导体组装测试系统用例及应用程序。
This paper considers a semiconductor assembly and test factory which is a three-segment-Constant Work-in-Process (CONWIP) system with overlapping machines. In the system, three types of carts circulate for meeting the physical requirements. The optimization problem in setting the suitable total Work-in-Process (WIP) level and the distribution in the three loops from the view of the trade-off between the throughput and the WIP level for the system is addressed. In the proposed model, the system is firstly modeled as a three-loop closed queue network and we propose an approximate method to evaluate the performance. The accuracy of the evaluation method was illustrated by numerical experiments, indicating that the method is fairly precise. Secondly, a Genetic Algorithm is designed to obtain near optimal results based on the performance evaluation. The semiconductor assembly and test system case as well as the application procedure were carried out in detail.
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期刊：
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