Theoretical Study on Synchronous Characterization of Surface and Interfacial Mechanical Properties of Thin-Film/Substrate Systems with Residual Stress Based on Pressure Blister Test Technique
Theoretical Study on Synchronous Characterization of Surface and Interfacial Mechanical Properties of Thin-Film/Substrate Systems with Residual Stress Based on Pressure Blister Test Technique
复制标题
基于压力起泡试验技术同步表征残余应力薄膜/基体体系表界面力学性能的理论研究
DOI：
10.3390/polym10010049
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发表时间：
2018-01
期刊：
影响因子：
5
通讯作者：
Zheng Zhou-Lian
中科院分区：
文献类型：
--
作者：
Yang Zhi-Xin;Sun Jun-Yi;Li Ke;Lian Yong-Sheng;He Xiao-Ting;Zheng Zhou-Lian
本研究基于压力起泡试验技术，提出了具有残余应力的薄膜/基底系统表面和界面力学性能同步表征的理论研究，解析解决了具有初始应力的起泡薄膜的轴对称变形问题，并给出了其闭式解。导出了确定表面薄膜泊松比、杨氏模量和残余应力的表达式；详细分析了施加的外部载荷所做的功和起泡薄膜中存储的弹性能，并推导了它们的表达式；最后给出了薄膜/基材单位脱层面积释放的界面粘附能（即能量释放率）。由于考虑了表面薄膜中的残余应力，这里提出的同步表征技术在理论上已经向前迈出了一大步。
In this study, based on the pressure blister test technique, a theoretical study on the synchronous characterization of surface and interfacial mechanical properties of thin-film/substrate systems with residual stress was presented, where the problem of axisymmetric deformation of a blistering film with initial stress was analytically solved and its closed-form solution was presented. The expressions to determine Poisson’s ratios, Young’s modulus, and residual stress of surface thin films were derived; the work done by the applied external load and the elastic energy stored in the blistering thin film were analyzed in detail and their expressions were derived; and the interfacial adhesion energy released per unit delamination area of thin-film/substrate (i.e., energy release rate) was finally presented. The synchronous characterization technique presented here has theoretically made a big step forward, due to the consideration for the residual stress in surface thin films.
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DOI：
10.1016/j.ijsolstr.2003.09.027
发表时间：
2004-02
影响因子：
3.6
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DOI：
10.1002/zamm.19940740713
发表时间：
1994
影响因子：
2.3
作者：
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