Flexible composite stamp for thermal nanoimprint lithography based on OrmoStamp
Flexible composite stamp for thermal nanoimprint lithography based on OrmoStamp
复制标题
基于 OrmoStamp 的热纳米压印柔性复合印模
DOI:
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发表时间:
2015
期刊:
影响因子:
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通讯作者:
H. Scheer
中科院分区:
文献类型:
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作者:
M. Papenheim;C. Steinberg;K. Dhima;Si Wang;H. Scheer
Flexible stamps are common for roll-to-roll processing but less common with planar processing, although they offer a number of benefits as, e.g., an improved conformal contact at reduced pressure. A simple way to realize such a flexible stamp is to use a two layer system with a structured top layer and a flexible backplane. The structured top layer is most easily obtained by molding, the backplane provides the flexibility envisaged. For use in a thermal nanoimprint process, a high thermal stability is required for both. This investigation addresses the preparation of flexible composite stamps with OrmoStamp as the structured top layer and polyimide as the flexible backplane. The process recommended for stamp preparation with OrmoStamp has to be modified to avoid bending after the hard bake that is required after ultraviolet-curing of the material to obtain a high stability of the top layer. Reduction of bending is advised, in particular, for large area stamps, where the hard bake step is in conflict with ...
影响因子:
56.9
作者:
JACKMAN, RJ;WILBUR, JL;WHITESIDES, GM
通讯作者:
WHITESIDES, GM