Scanning process of micro-spark assisted chemical engraving (SACE) based on thin laminar flow electrolytes and given narrow machining gaps

Scanning process of micro-spark assisted chemical engraving (SACE) based on thin laminar flow electrolytes and given narrow machining gaps
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基于薄层流电解质和给定窄加工间隙的微火花辅助化学雕刻(SACE)扫描过程

DOI:
10.1007/s00170-020-05705-z
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发表时间:
2020-07
影响因子:
3.4
通讯作者:
Junjie Li
Junjie Li
中科院分区:
工程技术3区
文献类型:
--
作者:
Yubin Pu;Hao Tong;Bolin Ji;Yong Li;Junjie Li

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火花辅助化学雕刻(SACE)具有接触应力较小、工具电极磨损小/无磨损等优点,有望实现对介电工件的无损伤加工。电解液深度和加工间隙的关键因素在SACE工艺中起着重要作用,特别是对于微SACE工艺。目前,尚无方便的方法在micro-SACE扫描过程中形成薄且稳定的电解质深度,并且现有方法难以指定工具电极与工件之间的微米级加工间隙。为了解决这些问题,提出了一种基于薄层流电解质和窄加工间隙的微SACE扫描工艺。本研究重点通过实验获得稳定电解质薄膜的可控规律,以集中加工能量并限制加工局部性。提出了一种间接电接触的新方法来测量工件表面高度,然后在扫描过程之前精确调平工件表面。采用带有 CCD(电荷耦合器件)视觉的微进给接触方法来实现狭窄的加工间隙。实验中工件表面整平精度可达±0.1μm/mm,微加工间隙调节分辨率可精确到±0.5μm。结果,在 ZrO2 工件表面获得了 1.2× 1.2 mm 的微观结构,深度去除分辨率低至 ~ 2 μm,流动层电解质薄至 165±5 μm。
Spark assisted chemical engraving (SACE) has the advantages of less contact stress and little/no tool electrode wear, and it is expected to achieve damage-free processing on dielectric workpieces. The key factors of electrolyte depths and machining gaps play an important role in the SACE process, especially for a micro-SACE process. Currently, there is still no convenient method for forming a thin and stable electrolyte depth in a scanning process of micro-SACE, and the existing methods are difficult to specify a micron-level machining gap between a tool electrode and a workpiece. In order to solve these problems, a scanning process of micro-SACE based on the thin laminar flow electrolyte and the narrow machining gap was proposed. This research focuses on the experiments to obtain the controllable rules of a stable thin film of electrolyte for concentrating the processing energy and restricting the processing locality. A novel method of indirect electric contact was presented for measuring workpiece surface height and then precisely leveling the workpiece surface before the scanning process. A micro-feed contact method with CCD (charge coupled device) vision was used to give a narrow machining gap. In experiments, the leveling accuracy of workpiece surface can reach ± 0.1 μm/mm, and the adjusting resolution of micro-machining gaps can be down to a precise scale of ± 0.5 μm. As a result, a micro-structure of 1.2 × 1.2 mm with a depth removal resolution down to ~ 2 μm was achieved on the surface of ZrO2workpiece with the flow layer electrolyte as thin as 165 ± 5 μm.
DOI: 10.1016/j.jallcom.2014.08.114
发表时间: 2015-02
影响因子: 6.2
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Wei Wang;Zuozhong Liang;Xiang-zhen Han;Jianfeng Chen;Chunyu Xue;Hong Zhao
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