Viscous Hot Glass Forming for Optical Wafer Level Packaging of Micro Mirrors
Viscous Hot Glass Forming for Optical Wafer Level Packaging of Micro Mirrors
复制标题
用于微镜光学晶圆级封装的粘性热玻璃成型
DOI：
10.1016/j.proeng.2012.09.085
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发表时间：
2012
期刊：
影响因子：
--
通讯作者：
W. Benecke
中科院分区：
文献类型：
--
作者：
V. Stenchly;H.-J. Quenzer;U. Hofmann;C. Eisermann;W. Benecke
MEMS反射镜在智能手机中的嵌入式微型投影仪等消费类应用中获得了相当大的兴趣。在移动系统中使用微镜需要一个坚固的包装，以防止系统受到颗粒，气体或流体的污染。到目前为止，在大多数已发表的MEMS镜像开发中，适当的光学封装一直被忽视。本文介绍了一种在8英寸晶圆上制作具有倾斜光学窗的MOEMS玻璃封装的独特技术，该技术可避免入射激光束在投影图像中产生强烈反射。新的粘性玻璃成型工艺使得使用粘结硅玻璃晶圆制造具有斜表面光学窗口的玻璃器件成为可能。
MEMS mirrors are gaining considerable interest for consumer applications like embedded pico projectors in smartphones. The use of micro mirrors in mobile systems demands for a robust package that prevents the system from contamination by particles, gases or fluids. Appropriate optical packaging so far has been neglected in most published MEMS mirror developments. This paper describes a unique technology to fabricate glass packages on 8 inch wafers with inclined optical windows for MOEMS on wafer scale which avoids the occurrence of highly intense reflections of the incident laser beam in the projected images. The new viscous glass forming process enables the fabrication of glass devices with optical windows with oblique surfaces using bonded silicon-glass wafers.
晶圆级真空封装微扫描镜的新型制造技术
DOI：
--
发表时间：
2007
期刊：
Electronic Packaging Technology Conference
影响因子：
--
作者：
M. Oldsen;U. Hofmann;H. Quenzer;B. Wagner
通讯作者：
B. Wagner