Online monitoring of the curing of adhesives with a miniaturised interdigital sensor using impedance spectroscopy
Online monitoring of the curing of adhesives with a miniaturised interdigital sensor using impedance spectroscopy
复制标题
使用阻抗谱技术通过小型叉指传感器在线监测粘合剂的固化
DOI：
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发表时间：
2018
期刊：
影响因子：
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通讯作者：
W. Lang
中科院分区：
文献类型：
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作者：
M. Hübner;G. Dumstorff;Maryam Kahali Mogaddam;P. Plagemann;W. Lang
摘要由于材料和应用的多样性，胶粘剂在生产过程中的监测及其使用寿命变得越来越重要。阻抗谱是一种适合于在线监测固化过程的方法。我们提出了一种小型化的叉指结构，用来用阻抗谱监测胶粘剂的固化过程。与其他传感器相比，我们的传感器是超薄的，所以它会消失在粘接接头中。因此，它可以留在关节内并用于寿命监测。此外，由于其细小的网格，它适用于薄型胶粘层。我们证明，嵌入在胶粘剂中的传感器的阻抗可以深入了解固化机理。因此，显示了对分散体和环氧体的监测。此外，使用该监测方法可以可靠地控制固化周期。应用叉指结构电场分析模型，从阻抗测量中提取粘合剂的介电常数。
Abstract Monitoring adhesives during manufacturing and their lifetime has become increasingly important due to the variety of materials and applications. Impedance spectroscopy is a suitable method for online monitoring of the curing process. We present a miniaturised interdigital structure to monitor the curing process of the adhesives using impedance spectroscopy. Compared to other sensors, our sensor is ultrathin, so that it disappears in the adhesive joint. Therefore, it can remain in the joint and be used for lifetime monitoring. In addition it is suitable for thin adhesive layers due to its fine grid. We demonstrate that the impedance of the sensor embedded in the adhesive gives insight into the curing mechanisms. Therefore monitoring of a dispersion and an epoxy is shown. In addition, the curing cycles can be reliably controlled using this monitoring method. The permittivity of the adhesives is extracted from the impedance measurements, applying analytical models of the electrical field of the interdigital structure.
影响因子：
4.3
作者：
Boll, Dmitriy;Schubert, Konstantin;Lang, Walter
通讯作者：
Lang, Walter