Chemical-assisted bonding of thermoplastics/elastomer for fabricating microfluidic valves.
Chemical-assisted bonding of thermoplastics/elastomer for fabricating microfluidic valves.
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DOI:
10.1021/ac101999w
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发表时间:
2011-01-01
影响因子:
7.4
通讯作者:
Fan, Z. Hugh
中科院分区:
文献类型:
--
作者:
Gu, Pan;Liu, Ke;Chen, Hong;Nishida, Toshikazu;Fan, Z. Hugh
Thermoplastics such as cyclic olefin copolymer (COC) and polymethylmethacrylate (PMMA) have been increasingly used in fabricating microfluidic devices. However, the state-of-the-art microvalve technology is a polydimethylsiloxane (PDMS)-based three-layer structure. In order to integrate such a valve with a thermoplastics-based microfluidic device, a bonding method for thermoplastics/PDMS must be developed. We report here a method to bond COC with PDMS through surface activation by corona discharge, surface modification using 3-(trimethoxysilyl)propyl methacrylate (TMSPMA), and thermal annealing. The method is also applicable to PMMA. The bonding strength between thermoplastics and PDMS was represented by the peeling force, which was measured using a method established by the International Organization for Standardization (ISO). The bonding strength measurement offered an objective and quantitative indicator for protocol optimization, as well as comparison with other PDMS-associated bonding methods. Using optimized bonding conditions, two valve arrays were fabricated in a COC/PDMS/COC device and cyclic operations of valve closing/opening were successfully demonstrated. The valve-containing devices withstood 100 psi (~689 KPa) without delamination. Further, we integrated such valve arrays in a device for protein separation and demonstrated isoelectric focusing in the presence of valves.
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影响因子:
6.1
作者:
Kersey, Lance;Ebacher, Vincent;Stoeber, Boris
通讯作者:
Stoeber, Boris
影响因子:
6.1
作者:
Easley, CJ;Karlinsey, JM;Landers, JP
通讯作者:
Landers, JP
影响因子:
7.4
作者:
Mair, Dieudonne A.;Rolandi, Marco;Frechet, Jean M. J.
通讯作者:
Frechet, Jean M. J.
影响因子:
7.4
作者:
Boone, T;Fan, ZH;Williams, S
通讯作者:
Williams, S
影响因子:
6.1
作者:
Ogonczyk, D.;Wegrzyn, J.;Garstecki, P.
通讯作者:
Garstecki, P.