Study on Process Parameters in CMP Ultra-Thin Stainless Steel Sheet
Study on Process Parameters in CMP Ultra-Thin Stainless Steel Sheet
复制标题
CMP超薄不锈钢板工艺参数研究
DOI:
10.4028/www.scientific.net/amr.1027.58
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发表时间:
2014-10
期刊:
影响因子:
--
通讯作者:
Jianxiu Su
中科院分区:
文献类型:
--
作者:
Haifeng Cheng Lijie Ma Jianguo Yao;Jianxiu Su
Chemical mechanical polishing (CMP) is the most effective technology to achieve ultra-smooth without damage surface in ultra-precision machining of stainless steel substrate. In this paper, according to the slurry ingredients obtained by former research,
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DOI:
--
发表时间:
2010
期刊:
Electronics Process Technology
影响因子:
--
作者:
Liu Yu-ling
通讯作者:
Liu Yu-ling
DOI:
10.1109/jstqe.2004.824112
发表时间:
2004-01-01
影响因子:
4.9
作者:
Sugimoto, A;Ochi, H;Tsuchida, M
通讯作者:
Tsuchida, M
DOI:
10.1109/jstqe.2004.824077
发表时间:
2004-01-01
影响因子:
4.9
作者:
Bardsley, JN
通讯作者:
Bardsley, JN
影响因子:
0.6
作者:
Gwon-Woo Choi;Woo-Sun Lee;Y. Seo
通讯作者:
Gwon-Woo Choi;Woo-Sun Lee;Y. Seo
影响因子:
4.8
作者:
D. Bo
通讯作者:
D. Bo