Embedded pitch adapters: A high-yield interconnection solution for strip sensors

M. Ullán;P. Allport;M. Baca;J. Broughton;A. Chisholm;K. Nikolopoulos;S. Pyatt;J. Thomas;J. Wilson;J. Kierstead;P. Kuczewski;D. Lynn;L. Hommels;C. Fleta;J. Fernandez;D. Quirion;I. Bloch;S. Díez;I. Gregor;K. Lohwasser;L. Poley;K. Tackmann;M. Hauser;K. Jakobs;S. Kuehn;K. Mahboubi;R. Mori;U. Parzefall;A. Clark;D. Ferrere;S. Sevilla;J. Ashby;A. Blue;R. Bates;C. Buttar;F. Doherty;T. Mcmullen;F. Mcewan;V. O’Shea;S. Kamada;K. Yamamura;Y. Ikegami;K. Nakamura;Y. Takubo;Y. Unno;R. Takashima;A. Chilingarov;H. Fox;A. Affolder;G. Casse;P. Dervan;D. Forshaw;A. Greenall;S. Wonsak;M. Wormald;V. Cindro;G. Kramberger;I. Mandić;M. Mikuž;I. Gorelov;M. Hoeferkamp;P. Palni;S. Seidel;A. Taylor;K. Toms;R. Wang;N. Hessey;N. Valencic;K. Hanagaki;K. Hanagaki;Z. Doležal;P. Kodyš;J. Bohm;M. Mikestikova;A. Bevan;G. Beck;C. Milke;M. Domingo;V. Fadeyev;Z. Galloway;D. Hibbard;Zhijun Liang;H. Sadrozinski;A. Seiden;K. To;R. French;P. Hodgson;H. Marin;K. Parker;O. Jinnouchi;K. Hara;J. Bernabeu;J. V. Civera;C. García;C. Lacasta;S. Garcia;D. Rodriguez;D. Santoyo;C. Solaz;U. Soldevila