Optimized Stress Testing for Flexible Hybrid Electronics Designs
Optimized Stress Testing for Flexible Hybrid Electronics Designs
复制标题
灵活混合电子设计的优化压力测试
DOI:
10.1109/vts.2019.8758661
复制
发表时间:
2019
期刊:
影响因子:
--
通讯作者:
Ozev, Sule
中科院分区:
文献类型:
--
作者:
Gao, Hang;Bhat, Ganapati;Ogras, Umit Y.;Ozev, Sule
登录
查看更多内容
影响因子:
2
作者:
Park, Jaehyun;Joshi, Hitesh;Lee, Hyung Gyu;Kiaei, Sayfe;Ogras, Umit Y.
通讯作者:
Ogras, Umit Y.
影响因子:
2
作者:
Bhat, Ganapati;Deb, Ranadeep;Ogras, Umit Y.
通讯作者:
Ogras, Umit Y.
DOI:
10.1145/2966986.2967057
发表时间:
2016
期刊:
2016 IEEE/ACM International Conference on Computer-Aided Design (ICCAD
影响因子:
--
作者:
Bhat, Ganapati;Gupta, Ujjwal;Tran, Nicholas;Park, Jaehyun;Ozev, Sule;Ogras, Umit Y.
通讯作者:
Ogras, Umit Y.
DOI:
--
发表时间:
2013
期刊:
European Microelectronics and Packaging Conference
影响因子:
--
作者:
D. A. van den Ende;F. Verhoeven;Pepijn van der Eijnden;R. Kusters;A. Sridhar;M. Cauwe;J. van den Brand
通讯作者:
J. van den Brand
DOI:
--
发表时间:
2016
期刊:
Workshop on Microelectronics and Electron Devices
影响因子:
--
作者:
Darrell E. Leber;Brian N. Meek;Seth D. Leija;Dale G. Wilson;Richard L. Chaney;D. Hackler
通讯作者:
D. Hackler