Investigation of mutual cross-correlation between integrated chip topography modelling and its image features
Investigation of mutual cross-correlation between integrated chip topography modelling and its image features
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集成芯片形貌建模与其图像特征之间互相关性的研究
DOI：
10.1504/ijcmsse.2013.053202
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发表时间：
2013-04
影响因子：
--
通讯作者：
B Y. Ye
中科院分区：
文献类型：
--
作者：
Z.W. Liang;X C. Liu;B Y. Ye
Since the mutual influence mechanism between IC chip topography modelling and its image features remains unstudied or uncertain, cross-correlation degree has been newly proposed to quantitatively evaluate this objective characteristic to be learned. Through obtaining digital images from IC micro surface and extracting its topography control point cloud, surface fitting in geometrical domain was used to acquire its spatial model. Mutual cross correlation evaluation system was established on this basis as respected. With a series of those calculated cross correlation degrees the mutual influence mechanism and its inherent performance results were quantitatively evaluated between image features and topography surface modelling. By repeatedly experiments the influence disciplines and mutual correlations in different experimental conditions were discussed, which will result to acquirement of final conclusions. This investigation provides valuable technical references and new research ideas for following IC surface topography research with a more effectively mathematical evaluation tool in practice.
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DOI：
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发表时间：
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影响因子：
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DOI：
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影响因子：
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影响因子：
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DOI：
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发表时间：
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期刊：
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影响因子：
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影响因子：
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