Single-Ended-Fed High-Gain LTCC Planar Aperture Antenna for 60 GHz Antenna-in-Package Applications
Single-Ended-Fed High-Gain LTCC Planar Aperture Antenna for 60 GHz Antenna-in-Package Applications
复制标题
适用于 60 GHz 封装天线应用的单端馈电高增益 LTCC 平面孔径天线
DOI:
10.1109/tap.2019.2917591
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发表时间:
2019-05
影响因子:
5.7
通讯作者:
Xue Quan
中科院分区:
文献类型:
--
作者:
Zhu Jianfeng;Yang Yang;Li Shufang;Liao Shaowei;Xue Quan
This paper presents new single-ended-fed planar aperture antennas (SPAAs) using low-temperature co-fired ceramics (LTCC) process technology. The SPAA element is proposed first, which not only inherits the merits of the aperture antennas including high gain and wide bandwidth but also exhibits advantages of low profile and compact size. The aperture is excited by a cross-shaped patch, and a loop-shaped balun structure placed below the patch is introduced to convert the single-ended signal into differential one to drive the patch. In this way, the energy can propagate on the patch in a traveling waveform and illuminate the aperture with uniform E-field distributions. Therefore, the antenna achieves good electrical and radiation performances, which are comparable to its balanced-fed counterparts, while processing a simplified structure. Measured results demonstrate that the impedance bandwidth of the antenna covers the 60 GHz license-free band (57–64 GHz), and the maximum gain can reach 11.5 dBi with a cavity area of only about 27 mm2. Furthermore, the element is successfully extended to a $4\,\,\times \,\,4$ element array using a substrate-integrated-waveguide based feeding network to further increase the gain up to 20.4 dBi. The measured results show that the impedance bandwidth of the array is from 57.5 to 65.7 GHz and the radiation performances are very stable over the operating frequency band.
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影响因子:
5.7
作者:
Junfeng Xu;Zhi Ning Chen;X. Qing;W. Hong
通讯作者:
Junfeng Xu;Zhi Ning Chen;X. Qing;W. Hong
影响因子:
5.7
作者:
Yue Li;Zhi Ning Chen;X. Qing;Zhijun Zhang;Junfeng Xu;Zhenghe Feng
通讯作者:
Yue Li;Zhi Ning Chen;X. Qing;Zhijun Zhang;Junfeng Xu;Zhenghe Feng
DOI:
10.1109/tcpmt.2011.2169064
发表时间:
2011-10
期刊:
IEEE Transactions on Components, Packaging and Manufacturing Technology
影响因子:
--
作者:
D. Kam;Duixian Liu;Arun Natarajan;Scott K. Reynolds;Brian A. Floyd
通讯作者:
D. Kam;Duixian Liu;Arun Natarajan;Scott K. Reynolds;Brian A. Floyd
影响因子:
5.7
作者:
W. C. Yang;H. Wang;W. Che;Y. Huang;J. Wang
通讯作者:
W. C. Yang;H. Wang;W. Che;Y. Huang;J. Wang
影响因子:
5.7
作者:
Bisharat, Dia'aaldin J.;Liao, Shaowei;Xue, Quan
通讯作者:
Xue, Quan