Damage-free surface treatment of carbon nanotubes and self-assembled monolayer devices using a neutral beam process for fusing top–down and bottom–up processes
Damage-free surface treatment of carbon nanotubes and self-assembled monolayer devices using a neutral beam process for fusing top–down and bottom–up processes
复制标题
使用中性束工艺融合自上而下和自下而上工艺对碳纳米管和自组装单层器件进行无损伤表面处理
DOI:
10.1088/0022-3727/41/2/024006
复制
发表时间:
2008
期刊:
影响因子:
--
通讯作者:
T. Ishida
中科院分区:
文献类型:
--
作者:
S. Samukawa;Y. Ishikawa;Keiji Okumura;Y. Sato;K. Tohji;T. Ishida
Plasma etching processes have been used for the past 30 years to shrink the pattern size of integrated devices. However, the inherent problems of plasma processes, such as ultraviolet photon radiation damage, limit the effectiveness of etching and surface treatments of nanoscale devices. To overcome these problems, we developed a neutral beam surface treatment process. The process uses neutral beams and a defect-free surface process to fabricate carbon nanotubes and self-assemble mono-layer devices. We found that neutral beams can be used to produce atomically defect-free surfaces in carbon nanotubes and organic molecules. This technique has potential for fabricating nanodevices.
DOI:
--
发表时间:
2004
期刊:
Journal of Vacuum Science and Technology A22・2
影响因子:
--
作者:
遠藤和彦;寒川誠二;Kazuhiko Endo;Seiji Samukawa;寒川 誠二;寒川 誠二;大竹浩人;久保田智広;石川健治;野田周一;Hiroto Ohtake;Tomohiro Kubota;Kenji Ishikawa;Shuichi Noda;寒川 誠二;寒川 誠二;寒川誠二;寒川誠二;寒川誠二
通讯作者:
寒川誠二