Selective electromagnetic interference shielding performance and superior mechanical strength of conductive polymer composites with oriented segregated conductive networks
Selective electromagnetic interference shielding performance and superior mechanical strength of conductive polymer composites with oriented segregated conductive networks
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具有定向隔离导电网络的导电聚合物复合材料的选择性电磁干扰屏蔽性能和优异的机械强度
DOI:
10.1016/j.cej.2019.05.074
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发表时间:
2019-10
影响因子:
15.1
通讯作者:
Li Zhong Ming
中科院分区:
文献类型:
--
作者:
Yu Wan Cheng;Zhang Guo Qiang;Liu Ya Hui;Xu Ling;Yan Ding Xiang;Huang Hua Dong;Tang Jian Hua;Xu Jia Zhuang;Li Zhong Ming
Manipulation of the conductive network is essential for the electromagnetic interference (EMI) shielding performance of conductive polymer composites, which have broad application prospects to address the concerns of electromagnetic pollution emitted by modern electronics. In this work, the oriented segregated structure was achieved in carbon nanotube (CNT)/ultrahigh molecular weight polyethylene (UHMWPE) composites via solid-phase stretching and the orientation of segregated network was controlled by adopting different draw ratios. Benefiting from the unique oriented segregated structure, the composites delivered prominent EMI shielding performance with intriguing frequency selectivity, which did not occur in conventional segregated composites. Moreover, remarkable mechanical reinforcement was obtained in the oriented segregated composites, which was attributed to the interfacial crystallization along segregated pathways and the formation of highly oriented lamellae. At a draw ratio of 6, the oriented segregated composite with 2 wt% CNTs showed the maximum EMI shielding effectiveness of 33.5 dB and tensile strength of 216.1 MPa, which surpassed the conventional segregated composite by 69.2% and 455.5%, respectively. This effort demonstrates a simple, feasible, and effective approach for the design and fabrication of mechanically robust, bandwidth-selective EMI shielding composites.
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影响因子:
6.4
作者:
Liang-Qing Zhang;Biao Yang;Jian Teng;Jun Lei;Ding-Xiang Yan;Gan-Ji Zhong;Zhong-Ming Li
通讯作者:
Zhong-Ming Li
DOI:
10.1109/tcpmt.2016.2606161
发表时间:
2016-09
期刊:
IEEE Transactions on Components, Packaging and Manufacturing Technology
影响因子:
--
作者:
Yang Tian;Hong Wang;Kokyan Lee;K. Ang
通讯作者:
Yang Tian;Hong Wang;Kokyan Lee;K. Ang
影响因子:
9.5
作者:
Weili Song;Congcheng Gong;Huimin Li;Xiaodong Cheng;Mingji Chen;Xujin Yuan;Haosen Chen;Yazheng Yang-Yazh
通讯作者:
Weili Song;Congcheng Gong;Huimin Li;Xiaodong Cheng;Mingji Chen;Xujin Yuan;Haosen Chen;Yazheng Yang-Yazh
影响因子:
10.9
作者:
Liang, Jiajie;Wang, Yan;Chen, Yongsheng
通讯作者:
Chen, Yongsheng
影响因子:
6.4
作者:
Kai Zhang;Gen-Hui Li;La-Mei Feng;Ning Wang;Jiang Guo;Kai Sun;Kai-Xin Yu;J. Zeng;Tingxi Li-Tin
通讯作者:
Kai Zhang;Gen-Hui Li;La-Mei Feng;Ning Wang;Jiang Guo;Kai Sun;Kai-Xin Yu;J. Zeng;Tingxi Li-Tin