Nanostructured diamond-TiC composites with high fracture toughness
Nanostructured diamond-TiC composites with high fracture toughness
复制标题
具有高断裂韧性的纳米结构金刚石-TiC复合材料
DOI:
10.1063/1.4789004
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发表时间:
2013-01
期刊:
影响因子:
--
通讯作者:
Chao Xu et al
中科院分区:
文献类型:
--
作者:
Haikuo Wang;Duanwei He;Chao Xu et al
We report the preparation of nanostructured diamond-TiC composites with high fracture toughness and high hardness starting from a ball-milled mixture of nano-sized Ti3SiC2 and submicron-sized diamond by simultaneously tuning the pressure-temperature conditions. The phase segregation of Ti3SiC2 at pressure of 5.5 GPa were investigated by X-ray diffraction and high resolution transmission electron microscopy, we found that the Ti3SiC2 could decompose into nanosized TiC and amorphous Ti-Si at 600–700 °C. The subsequent reaction between diamond and Ti-Si led to an amorphous Ti-Si-C matrix in which diamond and TiC crystals are embedded. With a loading force of 98 N, the measured fracture toughness KIC and Vicker's hardness HV of the synthesized composites reach up to 14 MPa m1/2 and 45.5 GPa, respectively. Our results demonstrate that the nanocrystalline/amorphous bonding matrix could largely enhance the toughness of the brittle composites.
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影响因子:
2
作者:
Haikuo Wang;D. He;Xiaozhi Yan;Chao Xu;Junwei Guan;N. Tan;Wendan Wang
通讯作者:
Haikuo Wang;D. He;Xiaozhi Yan;Chao Xu;Junwei Guan;N. Tan;Wendan Wang
影响因子:
4
作者:
E. Ekimov;A. Gavriliuk;B. Palosz;S. Gierlotka;P. Dłużewski;E. Tatianin;Yu. A. Kluev;A. M. Naletov;A. Presz
通讯作者:
E. Ekimov;A. Gavriliuk;B. Palosz;S. Gierlotka;P. Dłużewski;E. Tatianin;Yu. A. Kluev;A. M. Naletov;A. Presz
影响因子:
4.6
作者:
Sea-Fue Wang;Y. Hsu;Jui-Chen Pu;J. Sung;L. Hwa
通讯作者:
Sea-Fue Wang;Y. Hsu;Jui-Chen Pu;J. Sung;L. Hwa
DOI:
10.1016/0921-5093(95)10105-5
发表时间:
1996-05
影响因子:
6.4
作者:
D. Miess;G. Rai
通讯作者:
D. Miess;G. Rai
DOI:
10.1063/1.3488606
发表时间:
2010-11
期刊:
The Review of scientific instruments
影响因子:
--
作者:
Haikuo Wang;D. He;N. Tan;Wendan Wang;Jianghua Wang;Haini Dong;Huan Ma;Zili Kou;F. Peng;Xi Liu;Sicheng Li
通讯作者:
Haikuo Wang;D. He;N. Tan;Wendan Wang;Jianghua Wang;Haini Dong;Huan Ma;Zili Kou;F. Peng;Xi Liu;Sicheng Li