Lithiophilic Sn sites on 3D Cu current collector induced uniform lithium plating/stripping

Lithiophilic Sn sites on 3D Cu current collector induced uniform lithium plating/stripping
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3D Cu 集流体上的亲锂 Sn 位点诱导均匀的锂沉积/剥离

DOI:
10.1016/j.cej.2021.130177
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发表时间:
2021
影响因子:
15.1
通讯作者:
Xiufang Bian
Xiufang Bian
中科院分区:
工程技术1区
文献类型:
--
作者:
Rongzhang Guan;Shuai Liu;Chao Wang;Yinghui Yang;Dujiang Lu;Xiufang Bian

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随着锂充电电池高能量密度需求的不断增长,锂金属负极的发展受到关注。然而,其实际应用受到锂枝晶不受控制的生长的阻碍。在此,采用磁控溅射技术制备的具有亲锂Sn位点的3D Cu集流体(3D Cu@Sn),用于增强电子传导和锂离子扩散并引导均匀的Li生长。 3D Cu@Sn 中的通道增加了比表面积,三维结构降低了局部电流密度。此外,均匀的亲锂锡位点与锂具有优异的亲和力,构成快速电子传导和离子扩散网络。相场模拟和操作光学显微镜结果证明了锂的枝晶抑制和出色的可逆性。镀锂3D Cu@Sn对称电池在电流密度为1 mA cm−2时实现了超过3000小时的超长寿命,表现出优异的循环性能。此外,采用 LiCoO2 正极的全电池通过与镀锂 3D Cu@Sn 负极配对,表现出优异的循环性能并提高了容量保持率。
With continuously surging high-energy–density demand in lithium rechargeable batteries, soaring efforts have been spotlighted on lithium metal anode. However, its practical implementation is hindered by the uncontrolled growth of Li dendrites. Herein, 3D Cu current collector with lithiophilic Sn sites (3D Cu@Sn), fabricated by magnetron sputtering technique, was applied to enhance the electron conduction and lithium-ion diffusion and guide uniform Li growth. The channel in 3D Cu@Sn increases the specific surface area and the three-dimensional structure reduces the local current density. Moreover, the homogeneous lithiophilic Sn sites possess superior affinity with Li, which constructs as a fast electron conduction and ion diffusion network. Phase-field simulation and operando optical microscopy results demonstrate dendrite suppression and outstanding reversibility of Li. An ultralong lifespan over 3000 h was achieved at a current density of 1 mA cm−2in Li-plated 3D Cu@Sn symmetric cell, which exhibits an excellent cycling performance. Furthermore, the full cell with LiCoO2cathode displays excellent cycling performances and improved capacity retention by pairing with Li-plated 3D Cu@Sn anode.
在石墨炔上将铜纳米线自发分裂成量子点以抑制锂枝晶
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影响因子: 20.4
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