Effect of Sn addition on morphology evolution of secondary phase in hypomonotectic Cu-Pb-Sn alloy during solidification
Effect of Sn addition on morphology evolution of secondary phase in hypomonotectic Cu-Pb-Sn alloy during solidification
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Sn添加量对亚偏晶Cu-Pb-Sn合金凝固过程中第二相形貌演化的影响
DOI：
10.1016/j.jallcom.2019.03.388
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发表时间：
2019-06
影响因子：
6.2
通讯作者：
T.J.Li
中科院分区：
文献类型：
--
作者：
B.W.Dong;J.C.Jie;X.X.Yao;S.C.Liu;Y.H.Chen;N.Zhong;T.J.Li
在本研究中，Cu-24 Pb-xSn（wt.%）采用中频感应加热技术制备了不同形貌的富Pb第二相颗粒（SPPs）合金。实验结果表明，随着Sn含量从0 wt%增加到6 wt%，SPPs由网状向棒状转变。通过同步辐射X射线照相和热力学分析，揭示了Sn的作用机理。热力学计算表明，Sn的加入减弱了Cu-Pb体系的分层倾向。差示扫描量热法（DSC）表明，这也会导致单取代反应强度下降。同时，Sn的加入在凝固过程中引入了一个三相共存区（TRPC），该区域由富Cu液相（L1）、富Pb液相（L2）和固态α-Cu（S）组成。得益于这两种不互溶液体的流动性，L2倾向于表现出规则的棒状形貌，并最终转变为棒状SPP，这类似于一些不互溶的合金，如Al-Pb，Al-Bi和Ti-Ag合金。Cu-Pb-Sn合金伪二元相图中TRPC区的宽度随Sn含量的增加而增大。这是由于Sn含量的增加导致L1和L2之间的界面张力下降。同时，界面张力的降低会降低SPPs的Marangoni迁移速度，Marangoni迁移是SPPs碰撞凝聚的主要驱动力。因此，在这种情况下，Sn的添加有助于获得细小且分散的SPP。本工作对组织均匀、细化的相应亚钼合金的成分设计和生产具有指导意义。
In the present study, the Cu-24Pb-xSn (wt.%) alloys with Pb-rich secondary phase particles (SPPs) in different morphology were prepared by intermediate frequency induction heating technology. The experimental results show that the SPPs transform from network to rod-like morphology with Sn content increasing from 0 wt% to 6 wt%. The relevant function mechanism of Sn addition was revealed through synchrotron X-ray radiography and thermodynamic analysis. It is indicated from the thermodynamic calculation that Sn addition can weaken the demixing tendency in Cu-Pb system. This can also lead to intensity drop of the monotectic reaction which was characterized by differential scanning calorimetry (DSC). Simultaneously, a triple-phase-coexistence (TRPC) region is introduced with Sn addition during solidification, which contains a Cu-rich liquid (L1), a Pb-rich liquid (L2) and a solid α-Cu (S). Benefitted from the mobility of these two immiscible liquids,L2tends to show regular rod-like morphology and finally transform to rod-like SPPs, which is similar to some immiscible alloys containing an immiscibility gap, such as Al-Pb, Al-Bi and Ti-Ag alloys. The width of TRPC region in the pseudobinary phase diagram of Cu-Pb-Sn alloy increases with increasing Sn content. This is attributed to the fact that increasing Sn content can lead to the drop of interfacial tension betweenL1andL2. Simultaneously, the interfacial tension drop will decrease the Marangoni migration velocity of the SPPs, and the Marangoni migration serves as the main driven force of SPPs' collision and coagulation in this case. Therefore, Sn addition is helpful to obtain fine and dispersed SPPs in this case. This work possesses guiding significance to the composition design and production of relevant hypomonotectic alloy with homogeneous and refined microstructure.
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