Multi-SP: a representation with united rectangles for analog placement and routing
Multi-SP: a representation with united rectangles for analog placement and routing
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多 SP：用于模拟布局和布线的联合矩形表示
DOI：
10.1109/isvlsi.2006.64
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发表时间：
2006
期刊：
影响因子：
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通讯作者：
S. Nakatake
中科院分区：
文献类型：
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作者：
Ning Fu;Mitsutoshi Mineshima;S. Nakatake
在模拟版图中，布局和布线在面积优化、寄生效应、可变性等方面紧密相连，本文在布局和多层布线中引入了一种通用的数据结构，其中器件和布线用联合矩形表示。这被称为多层序列对（multi-SP）。我们还提供了一个双向之间的翻译布局和多SP下的约束。由于多SP不受几何限制，因此它使我们能够管理多种方法，例如设备调整和技术迁移。同时，给出了一种同时优化布局和布线的器件和布线之间寄生效应的方法。我们实现了一个基于多SP的压缩工具，并通过实验展示了它的潜力
In analog layout, the placement and routing are closely connected with each other in the optimization of the area, the parasitics, the mutability and so on. In this paper, we introduce a common data-structure to the placement and multilayer routing, where devices and wires are represented by united rectangles. It is called multi-layer sequence-pair (multi-SP). We also provide a bi-directional translation between a layout and a multi-SP under align-constraint. Since the multi-SP is geometry free, it enables us to manage diversified methodologies such as device sizing and technology migration. Also, it gives a way to take the parasitics between devices and wires of optimizing placement and routing simultaneously. We implemented a compaction tool based on multi-SP and showed its potential experimentally
Shigetoshi Nakatake：“基于 BSG 结构的模块打包”
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