Lamellar instabilities during scanning laser melting of Al–Cu eutectic and hypoeutectic thin films
Lamellar instabilities during scanning laser melting of Al–Cu eutectic and hypoeutectic thin films
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Al-Cu共晶和亚共晶薄膜扫描激光熔化过程中的层状不稳定性
DOI:
10.1016/j.jallcom.2021.158800
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发表时间:
2021
影响因子:
6.2
通讯作者:
Floro, J.A.
中科院分区:
文献类型:
--
作者:
Sullivan, E.J.;Tomko, J.A.;Skelton, J.M.;Fitz-Gerald, J.M.;Hopkins, P.E.;Floro, J.A.
Scanning laser melting was employed to investigate directional solidification in Al–Cu thin films, 200 and 500 nm thick. The Al–Cu alloy films, with both eutectic and hypoeutectic compositions, were co-deposited on fused silica substrates by magnetron sputtering. Melting of the films was carried out in air using a CW laser, as a function of the scan velocity, v, up to 5 cm/s. For eutectic films, regular lamellar microstructure was observed over the entire range of velocities studied. Interlamellar spacings, λ, below 50 nm were readily produced. Results were found to be consistent with studies on bulk Al–Cu alloys, obeying the classic steady state lamellar growth relationship, λ2v = K. However, the value of the constant, K is significantly larger in thin films when compared to bulk. This is attributed to constraints on mechanisms for spacing adjustment in two-dimensional eutectic systems. In the hypoeutectic thin films, a complex lamellar structure was observed as the scan velocity was reduced. Regions of straight lamellae, oscillatory lamellae, solitary tilt waves, and recurring extreme lamellar branching events coexisted across the melt track. Fourier analysis was used to quantify the chaotic area fraction of the films. The transition to chaos occurred as the G/v ratio increased, attributed to approaching a re-entrant eutectic-to-dendritic transition from above. Approaches to further refine laser melting in thin eutectic films in order to better control solidification processes are discussed.
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DOI:
--
发表时间:
1981
期刊:
影响因子:
--
作者:
H. Cline
通讯作者:
H. Cline
DOI:
--
发表时间:
1987
期刊:
影响因子:
--
作者:
B. Ditchek
通讯作者:
B. Ditchek
DOI:
--
发表时间:
1995
期刊:
影响因子:
--
作者:
P. Gilgien;A. Zryd;W. Kurz
通讯作者:
W. Kurz
DOI:
10.1016/0956-7151(93)90237-m
发表时间:
1993-12-01
期刊:
ACTA METALLURGICA ET MATERIALIA
影响因子:
--
作者:
GILL, SC;KURZ, W
通讯作者:
KURZ, W
影响因子:
1.6
作者:
D. Cooksey;D. Munson;M. Wilkinson;A. Hellawell
通讯作者:
D. Cooksey;D. Munson;M. Wilkinson;A. Hellawell