Analysis and Design of Capacitive Parametric Ultrasonic Transducers for Efficient Ultrasonic Power Transfer Based on a 1-D Lumped Model
Analysis and Design of Capacitive Parametric Ultrasonic Transducers for Efficient Ultrasonic Power Transfer Based on a 1-D Lumped Model
复制标题
基于一维集总模型的电容式参数超声波换能器的分析和设计,用于高效超声波功率传输
DOI:
10.1109/tuffc.2018.2866058
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发表时间:
2018
期刊:
影响因子:
--
通讯作者:
Degertekin, F. Levent
中科院分区:
文献类型:
--
作者:
Surappa, Sushruta;Tao, Molei;Degertekin, F. Levent
There is an increasing interest in wireless power transfer for medical implants, sensor networks, and consumer electronics. A passive capacitive parametric ultrasonic transducer (CPUT) can be suitable for these applications as it does not require a dc bias or a permanent charge. In this paper, we present a 1-D lumped parameter model of the CPUT to study its operation and investigate relevant design parameters for power transfer applications. The CPUT is modeled as an ultrasound-driven piston coupled to an RLC resonator resulting in a system of two coupled nonlinear ordinary differential equations. Simulink is used along with an analytical approximation of the system to obtain the voltage across the capacitor and displacement of the piston. Parametric resonance threshold and ultrasound-to-electrical conversion efficiency are evaluated, and the dependence of these performance metrics on the load resistance, input ultrasound intensity, forcing frequency, electrode coverage area, gap height, and the mechanical Q-factor are studied. Based on this analysis, design guidelines are proposed for highly efficient power transfer. Guided by these results, practical device designs are obtained through COMSOL simulations. Finally, the feasibility of using the CPUT in air is predicted to set the foundation for further research in ultrasonic wireless power transfer, energy harvesting, and sensing.
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影响因子:
3.6
作者:
Arbabian, Amin;Chang, Ting Chia;Weber, Marcus J.
通讯作者:
Weber, Marcus J.
DOI:
10.1016/j.cnsns.2018.11.003
发表时间:
2018-06
期刊:
Commun. Nonlinear Sci. Numer. Simul.
影响因子:
--
作者:
Molei Tao
通讯作者:
Molei Tao
DOI:
10.1109/memsys.2009.4805565
发表时间:
2009
期刊:
2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems
影响因子:
--
作者:
U. Bartsch;J. Caspar;O. Paul
通讯作者:
O. Paul
DOI:
--
发表时间:
2007
期刊:
2007 IEEE Ultrasonics Symposium Proceedings
影响因子:
--
作者:
S. H. Wong;M. Kupnik;Kim Butts;B. Khuri
通讯作者:
B. Khuri