Microstructure and Properties of Bulk Ultrafine-Grained Cu1.5Cr0.1Si Alloy through ECAP by Route C and Aging Treatment
Microstructure and Properties of Bulk Ultrafine-Grained Cu1.5Cr0.1Si Alloy through ECAP by Route C and Aging Treatment
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C路线及时效处理ECAP大块超细晶Cu1.5Cr0.1Si合金的组织与性能
DOI：
10.3390/cryst10030207
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发表时间：
2020-03
期刊：
影响因子：
2.7
通讯作者：
Ding Yutian
中科院分区：
文献类型：
--
作者：
Guo Tingbiao;Xiaoyang Tai;Wei Shiru;Junjie Wang;Jia Zhi;Ding Yutian
采用扫描电子显微镜(SEM)、X射线衍射(XRD)和电子背散射衍射(EBSD)研究了等通道角挤压(ECAP)-C路径变形和时效处理后Cu1.5Cr0.1Si合金的微观组织演变及其对力学和导电性能的影响。研究发现，室温ECAP-C变形后，随着时效时间的延长，Cu1.5Cr0.1Si合金中形成了强的(111)宏观取向。 ECAP形成的超细晶体和时效过程中沿晶界析出的富铬相大大提高了材料强度。 350℃时效4h后，拉伸强度、伸长率和电导率分别达到528MPa、15.27%和78.9%IACS。合金的断裂模式为韧性断裂。稳定取向的{111}织构有利于提高材料的电导率。
The evolutions of the microstructure and its effect on the mechanical and electrical conductivity properties of Cu1.5Cr0.1Si alloy after equal channel angle pressing (ECAP)-C path deformation and aging treatment have been investigated using scanning electron microscopy (SEM), x-ray diffraction (XRD), and electron back-scattered diffraction (EBSD). It was found that after the ECAP-C deformation at room temperature, with an extension of aging time, the strong (111) macro orientation formed in the Cu1.5Cr0.1Si alloy. The ultrafine crystals formed by ECAP and the rich chromium phase precipitated along grain boundaries during the aging process greatly improved the material strength. After aging at 350 °C for 4 h, the tensile strength, elongation, and conductivity reached 528 MPa, 15.27%, and 78.9% IACS, respectively. The fracture mode of the alloy was ductile fracture. The steady-oriented {111} texture was beneficial to improving the conductivity of the material.
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DOI：
10.1016/j.msea.2019.05.003
发表时间：
2019-06-24
影响因子：
6.4
作者：
Zhao, Zhilei;Xiao, Zhu;Zhang, Sangjian
通讯作者：
Zhang, Sangjian
影响因子：
9.4
作者：
Vinogradov, A;Patlan, V;Kopylov, VI
通讯作者：
Kopylov, VI
影响因子：
8.4
作者：
M. Vaseghi;Hyoung-Seop Kim
通讯作者：
M. Vaseghi;Hyoung-Seop Kim
影响因子：
0.7
作者：
Guo Tingbiao;Ding Yutian;Yuan Xun-Feng;Hu Yong
通讯作者：
Guo Tingbiao;Ding Yutian;Yuan Xun-Feng;Hu Yong
影响因子：
0.7
作者：
Chengpeng Wang;Fuguo Li;Bo Chen;Zhanwei Yuan;Hongya Lu
通讯作者：
Chengpeng Wang;Fuguo Li;Bo Chen;Zhanwei Yuan;Hongya Lu