Manufacturing of Conductive Circuits for Embedding Stereolithography by Means of Conductive Adhesive and Laser Sintering
Manufacturing of Conductive Circuits for Embedding Stereolithography by Means of Conductive Adhesive and Laser Sintering
复制标题
通过导电粘合剂和激光烧结制造用于嵌入立体光刻的导电电路
DOI：
10.1016/j.phpro.2014.08.179
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发表时间：
2014
期刊：
影响因子：
--
通讯作者：
Schmidt
中科院分区：
文献类型：
--
作者：
Stichel;Urmoneit;Schmidt
嵌入式光固化成型（eSLA）是一种添加剂混合工艺，它将3D组件的灵活生产与电气和光学传导结构和功能组件的集成相结合。在一个制造过程中的几个工艺步骤的组合意味着一个关于组件的集成密度的高技术潜力。为了在SLA部件的内部和表面上创建导电电路，这些结构的制造过程必须集成到SLA过程中，并且不应该包含从SLA构建平台上拆卸部件。在这一背景下，采用点胶和激光烧结的方法生产嵌入式导电线路是一种非常有前途的工艺，点胶可以在整个SLA过程中进行，通过这种方式，导电粘合剂可以存款在部件内部，并且这些结构的导电性将在下一步通过激光烧结实现。本文显示了关于导电胶对嵌入式光固化成型和激光烧结工艺的适用性。
The embedding stereolithography (eSLA) is an additive, hybrid process which combines the flexible production of 3D-components with the integration of electrical and optical conductive structures and functional components. This combination of several process steps in one manufacturing process implies a high technological potential regarding the integration density of the assemblies.To create conductive circuitsinside and on the surface of SLA-parts, the manufacturing process of these structures has to be integrated into the SLA-process and shouldnot contain disassembling of partsfrom the SLA-building platform. In this context, the production of embedded conductive circuits by means of dispensing conductive adhesivesand laser sintering is a highly promising process.The dispensing can be made during the entire SLA-process by interrupting it. In this way the conductive adhesive can be deposit inside the part and the electrical conductivity of these structures will be achieved by laser sintering in the next step.This paper shows fundamental investigations concerning the applicability of the conductive adhesive for embedding stereolithography and the laser sintering process as well.
DOI：
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发表时间：
2010
期刊：
影响因子：
--
作者：
K. Maekawa;K. Yamasaki;T. Niizeki;M. Mita;Y. Matsuba;N. Terada;H. Saito
通讯作者：
H. Saito