The enhanced negative thermal expansion in less-oxygen-vacancies copper pyrophosphate
The enhanced negative thermal expansion in less-oxygen-vacancies copper pyrophosphate
复制标题
少氧空位焦磷酸铜增强的负热膨胀
DOI：
10.1016/j.jmst.2022.10.054
复制
发表时间：
2023
影响因子：
10.9
通讯作者：
Yuping Sun
中科院分区：
文献类型：
--
作者：
Lulu Xie;Tongfei Shi;Jianchao Lin;Xuekai Zhang;Xiaokang Zhong;Keke Liu;Buke Dong;Cheng Yang;Xuelian Wang;Tingjiao Xiong;Wensheng Yan;Juping Xu;Hongcan Chen;Wen Yin;Ming Li;Peng Tong;Wenhai Song;Yuping Sun
对于氧化物来说，控制氧空位的浓度是优化其功能性质的一个有用的方法。然而，在负热膨胀材料领域，尽管氧化物型负热膨胀材料占负热膨胀材料总数的40%以上，但氧空位对负热膨胀的影响却很少受到关注。在这里，我们报告了焦磷酸铜在250-350 K的线性热膨胀系数（即，当合成温度从1073 K提高到1373 K时，Cu_2 P_2 O_7的合成速率从-13.88 ppm/K提高到-36.60 ppm/K。结合X射线吸收近边结构、中子粉末衍射和X射线衍射的研究证实了低温合成样品中O 1位的选择性空位，它同时抑制了相变和骨架结构驱动的NTE。我们的研究结果提出了一种新的方法来优化氧化物的NTE效应。
For oxides, controlling the concentration of oxygen vacancy is a useful way to optimize their functional properties. However, when it comes to the field of negative thermal expansion (NTE), much less attention has been paid to the effect of oxygen vacancy on NTE, though oxide-typed NTE materials account for more than 40% of the total NTE materials. Here, we report that the linear coefficient of thermal expansion at 250–350 K of copper pyrophosphate (i.e., Cu2P2O7) can be significantly improved from –13.88 to –36.60 ppm/K when the synthesis temperature is raised from 1073 to 1373 K. The combined study including X-ray absorption near edge structure, neutron powder diffraction, and X-ray diffraction has confirmed the selective vacancies in the O1 site for low-temperature synthesized samples, which suppress both the phase-transition and framework-structure driven NTE simultaneously. Our result proposes a new approach for optimizing the NTE effect of oxides.
登录
查看更多内容
氧空位簇促进二氧化铈纳米棒的还原性和活性
影响因子：
15
作者：
Liu, Xiangwen;Zhou, Kebin;Li, Yadong
通讯作者：
Li, Yadong
影响因子：
1.1
作者：
P. N. Timonin
通讯作者：
P. N. Timonin
影响因子：
16.6
作者：
Phillips, Anthony E.;Goodwin, Andrew L.;Kepert, Cameron J.
通讯作者：
Kepert, Cameron J.
影响因子：
4
作者：
Takenaka, K;Takagi, H
通讯作者：
Takagi, H
影响因子：
3.5
作者：
S. Sumithra;A. Umarji
通讯作者：
S. Sumithra;A. Umarji