Etching organic low dielectric film in ultrahigh frequency plasma using N2/H2 and N2/NH3 gases
Etching organic low dielectric film in ultrahigh frequency plasma using N2/H2 and N2/NH3 gases
复制标题
使用 N2/H2 和 N2/NH3 气体在超高频等离子体中蚀刻有机低介电薄膜
DOI:
10.1063/1.1588351
复制
发表时间:
2003
影响因子:
3.2
通讯作者:
T. Goto
中科院分区:
文献类型:
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作者:
H. Nagai;M. Hiramatsu;M. Hori;T. Goto
The behavior of species in the gas phase and their effects on the etching characteristics of organic film with the lower dielectric constant (low-k) were investigated in 500 MHz ultrahigh frequency (UHF) plasma using N2/H2 and N2/NH3 gases. The absolute H and N radical densities and NH3 molecule density in etching plasmas were evaluated by the vacuum ultraviolet absorption spectroscopy and the infrared diode laser absorption spectroscopy technique, respectively. The effects of frequency that excited the plasma in the production of H and N radicals were clarified by comparing the behavior of radicals in the UHF plasma with that in the inductively coupled plasma (ICP) exciting at the frequency of 13.56 MHz reported in the previous study. H radicals were produced more efficiently from NH3 gas and N radicals more efficiently from N2 gas in the UHF plasma than in the ICP. H radicals were generated not only through the dissociation of the H2 molecule but also from NH3 molecules produced in the N2/H2 plasma. On ...
DOI:
--
发表时间:
2001
期刊:
影响因子:
--
作者:
S. Takashima;S. Arai;M. Hori;T. Goto;A. Kono;Masafumi Ito;K. Yoneda
通讯作者:
K. Yoneda