Porous (SiCw-Si3N4w)/(Si3N4-SiC) composite with enhanced mechanical performance fabricated by 3D printing
Porous (SiCw-Si3N4w)/(Si3N4-SiC) composite with enhanced mechanical performance fabricated by 3D printing
复制标题
通过3D打印制备具有增强机械性能的多孔(SiCw-Si3N4w)/(Si3N4-SiC)复合材料
DOI：
10.1016/j.ceramint.2018.05.011
复制
发表时间：
2018-08
影响因子：
5.2
通讯作者：
Cheng Laifei
中科院分区：
文献类型：
--
作者：
Xiao Shanshan;Mei Hui;Han Daoyang;Yuan Wenyu;Cheng Laifei
采用打印硅体氮化和化学气相渗SiC相结合的方法，首次通过3D打印合成了SiC晶须和si3n4晶须增强Si3N4-SiC (（SiCw-Si3N4w)/(Si3N4-SiC)）复合材料。通过调整sicw含量和加载方向可以优化复合材料的力学性能。结果表明，sicw3 wt%为最佳方案，与无晶须材料相比，平均堆积密度提高22.4%，抗弯强度提高63.6%，平行于打印层的抗压强度提高404.8%，垂直于打印层的抗压强度提高157.1%。力学性能的提高主要归因于CVI致密化过程，以及均匀晶须桥接、拉出和偏转裂纹对能量消耗的影响。所获得的指标满足了针对商业和军事领域应用的3d打印多孔陶瓷基复合材料的要求。
SiC whisker and Si3N4whisker-reinforced Si3N4-SiC ((SiCw-Si3N4w)/(Si3N4-SiC)) composite was synthesized by 3D printing for the first time, by the combination of printed-Si-body nitridation and chemical vapor infiltration-SiC methods. The mechanical properties of the composite could be optimized through the adjustment of SiCwcontent and load direction. A SiCwcontent of 3 wt% was found to be the optimal scheme, and accordingly, the average bulk density increased by 22.4%, the bending strength increased by 63.6%, the compressive strength parallel to the printing layer increased by 404.8%, and the compressive strength perpendicular to the printing layer increased by 157.1%, compared with the bulks without whiskers. The enhanced mechanical performance was mainly attributed to the process of densification by CVI, and the effect of the homogeneous whiskers bridging, pull-out and deflecting crack to expend energy. The achieved indices meet the requirements for 3D-printed porous ceramic matrix composite targeted for commercial and military field applications.
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DOI：
10.19030/ijmis.v18i4.8819
发表时间：
2014-09
期刊：
--
影响因子：
--
作者：
G. Brooks;Kimberley Kinsley;Tim Owens
通讯作者：
G. Brooks;Kimberley Kinsley;Tim Owens
DOI：
10.1002/adma.201501099
发表时间：
2015-07-15
期刊：
Advanced materials (Deerfield Beach, Fla.)
影响因子：
--
作者：
Hong S;Sycks D;Chan HF;Lin S;Lopez GP;Guilak F;Leong KW;Zhao X
通讯作者：
Zhao X
DOI：
--
发表时间：
2013-02
期刊：
--
影响因子：
--
作者：
Hod Lipson;M. Kurman
通讯作者：
Hod Lipson;M. Kurman
DOI：
10.1016/j.msea.2009.12.027
发表时间：
2010-03
影响因子：
6.4
作者：
Zhao-Hui Zhang;Fu-chi Wang;Jie Luo;Shu-Kui Lee;Lu Wang
通讯作者：
Zhao-Hui Zhang;Fu-chi Wang;Jie Luo;Shu-Kui Lee;Lu Wang
SiCw-Al2O3复合材料冷却过程中残余应力对晶须增强体的影响
影响因子：
6.2
作者：
Weiwei Wu;Jingya Gui;Tianbin Zhu;Zhipeng Xie
通讯作者：
Zhipeng Xie