Liquid metal droplets bouncing higher on thicker water layer.

Liquid metal droplets bouncing higher on thicker water layer.
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DOI:
10.1038/s41467-023-39348-x
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发表时间:
2023-06-14
影响因子:
16.6
通讯作者:
Wang, Zuankai
Wang, Zuankai
中科院分区:
综合性期刊1区
文献类型:
--
作者:
Dai, Yuhang;Li, Minfei;Ji, Bingqiang;Wang, Xiong;Yang, Siyan;Yu, Peng;Wang, Steven;Hao, Chonglei;Wang, Zuankai

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液态金属(LM)由于其熔化温度低、柔韧性好、导电导热性好等特点,在柔性电子、软机器人、芯片冷却等领域得到了广泛的应用。在环境条件下,LM易受薄氧化物层的覆盖,导致与底层衬底的不必要的粘附,削弱其原本的高迁移率。在这里,我们发现了一个不寻常的现象,其特征在于LM液滴从水层完全反弹,可以忽略不计的粘附力。更违反直觉的是,恢复系数(定义为撞击前后液滴速度之比)随水层厚度增加而增加。我们发现,LM液滴的完全反弹起源于一个薄的低粘度水润滑膜,防止液滴-固体接触低粘性耗散的捕获,和恢复系数调制的负毛细管压力在润滑膜作为一个结果的LM液滴上的水的自发蔓延。我们的研究结果推进了对复杂流体液滴动力学的基本理解,并为流体控制提供了见解。液态金属广泛应用于柔性电子和软机器人应用中,但它们与下面的固体基底的粘附是不需要的。Dai等人表明,液态金属液滴可以克服粘附力,并从覆盖有足够厚度的水膜的表面反弹。
Liquid metal (LM) has gained increasing attention for a wide range of applications, such as flexible electronics, soft robots, and chip cooling devices, owing to its low melting temperature, good flexibility, and high electrical and thermal conductivity. In ambient conditions, LM is susceptible to the coverage of a thin oxide layer, resulting in unwanted adhesion with underlying substrates that undercuts its originally high mobility. Here, we discover an unusual phenomenon characterized by the complete rebound of LM droplets from the water layer with negligible adhesion. More counterintuitively, the restitution coefficient, defined as the ratio between the droplet velocities after and before impact, increases with water layer thickness. We reveal that the complete rebound of LM droplets originates from the trapping of a thinly low-viscosity water lubrication film that prevents droplet-solid contact with low viscous dissipation, and the restitution coefficient is modulated by the negative capillary pressure in the lubrication film as a result of the spontaneous spreading of water on the LM droplet. Our findings advance the fundamental understanding of complex fluids’ droplet dynamics and provide insights for fluid control. Liquid metals are widely used in flexible electronics and soft robotics applications, but their adhesion to underlying solid substrates is unwanted. Dai et al. show that liquid metal droplets can overcome adhesion forces and bounce off from the surface covered with a water film with sufficient thickness.
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