Topical gel-based biomaterials for the treatment of diabetic foot ulcers.
Topical gel-based biomaterials for the treatment of diabetic foot ulcers.
复制标题
用于治疗糖尿病足溃疡的局部凝胶生物材料。
DOI:
10.1016/j.actbio.2021.10.045
复制
发表时间:
2022-01-15
影响因子:
9.7
通讯作者:
Zgheib C
中科院分区:
文献类型:
--
作者:
Bardill JR;Laughter MR;Stager M;Liechty KW;Krebs MD;Zgheib C
Diabetic foot ulcers (DFUs) are a devastating ailment for many diabetic patients with increasing prevalence and morbidity. The complex pathophysiology of DFU wound environments has made finding effective treatments difficult. Standard wound care treatments have limited efficacy in healing these types of chronic wounds. Topical biomaterial gels have been developed to implement novel treatment approaches to improve therapeutic effects and are advantageous due to their ease of application, tunability, and ability to improve therapeutic release characteristics. Here, we provide an updated, comprehensive review of novel topical biomaterial gels developed for treating chronic DFUs. This review will examine preclinical data for topical gel treatments in diabetic animal models and clinical applications, focusing on gels with protein/peptides, drug, cellular, herbal/antioxidant, and nano/microparticle approaches.
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DOI:
10.1155/2012/468764
发表时间:
2012
期刊:
Evidence-based complementary and alternative medicine : eCAM
影响因子:
--
作者:
Al-Bayaty F;Abdulla MA
通讯作者:
Abdulla MA
DOI:
10.1111/j.1524-475x.2011.00748.x
发表时间:
2012-01
期刊:
Wound repair and regeneration : official publication of the Wound Healing Society [and] the European Tissue Repair Society
影响因子:
--
作者:
Ashcroft GS;Jeong MJ;Ashworth JJ;Hardman M;Jin W;Moutsopoulos N;Wild T;McCartney-Francis N;Sim D;McGrady G;Song XY;Wahl SM
通讯作者:
Wahl SM
影响因子:
4.4
作者:
Escárcega-Galaz AA;Cruz-Mercado JL;López-Cervantes J;Sánchez-Machado DI;Brito-Zurita OR;Ornelas-Aguirre JM
通讯作者:
Ornelas-Aguirre JM
影响因子:
3.7
作者:
Allen RJ Jr;Soares MA;Haberman ID;Szpalski C;Schachar J;Lin CD;Nguyen PD;Saadeh PB;Warren SM
通讯作者:
Warren SM
影响因子:
2.9
作者:
Armstrong, David G.;Swerdlow, Mark A.;Bus, Sicco A.
通讯作者:
Bus, Sicco A.