Cu-bearing high-entropy alloys with excellent antiviral properties.
Cu-bearing high-entropy alloys with excellent antiviral properties.
复制标题
具有优异抗病毒性能的含铜高熵合金
DOI:
10.1016/j.jmst.2020.12.027
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发表时间:
2021-09-10
影响因子:
10.9
通讯作者:
Wang F
中科院分区:
文献类型:
--
作者:
Li Z;Qiao D;Xu Y;Zhou E;Yang C;Yuan X;Lu Y;Gu JD;Wolfgang S;Xu D;Wang F
The worldwide outbreak of COVID-19 since December 2019 has caused great challenges to health organizations, and brought tremendous impact on the global economy. There have been over 62.3 million confirmed infection cases and 1.4 million deaths reported until now (December 1 st, 2020), and the numbers are still growing [1]. Although not as influential as COVID-19, the other two large pandemics, severe acute respiratory syndrome (SARS, outbroke in 2002) and Middle East respiratory syndrome (MERS, outbroke in 2012), were also caused by coronaviruses and resulted in severe public health and economic crises in several countries [2, 3]. Accompanied by the globalization, the highly connected human society through air travel and conventions offers convenience for the rapid spreading of viruses. Moreover, the occurrence of undetected viruses and their high spontaneous mutation rate challenge the cognitive process and the development of antiviral agents. In this view, the development of broad-spectrum antiviral strategies for prevention and control of viral transmission is of great importance for protecting our human society. Viruses are obligate parasites that can only replicate inside living cells. Viruses in form of independent particles are called virions, which are composed of at least two parts:(1) genetic material (DNA or RNA) and (2) a protein coat surrounding and protecting the genetic material. Some viruses may also be enveloped in a lipid capsule, when they are released from the host cells. The spreading of viruses varies greatly depending on the specific species, infectivity, and the subsequent relationship with the host. Viruses causing epidemic diseases, eg, COV-2019, always spread through many routes such as air, water, respiratory droplets, food, and surface contact etc. Much research has focused on the development of antiviral agents that can disrupt the viral replication cycle or destroy them completely [4]. However, the utilization of antiviral materials to block the viral transmission, before they contact human cells, can be meaningful in many applications, such as the healthcare, pharmaceutical manufacturing, food processing, public transport and facilities and scientific research etc. The utilization of metallic copper (Cu) for antimicrobial applications has attracted for a long-time enormous attention in infection control, including medical implants. The proper addition of Cu in alloys has been confirmed to be biologically safe and efficient in inhibition of many microorganisms non-selectively [5]. Several mechanisms have been proposed to illustrate the intrinsic mechanisms of the copper-mediated antimicrobial function including disruption of cellular membranes resulting from direct contact, reactive hydroxyl radicals generated through Fenton reactions, and ligand interactions mediated by copper ions destroying the structure and integrity of DNA and RNA etc.[6, 7]. Since metallic copper can react with multiple active sites without selectivity to the cells, its broad-spectrum antimicrobial efficacy is well known besides the low possibility for pathogens to develop a resistance. Besides the antibacterial and antifungal properties, metallic copper has also been reported for antiviral applications as a constituent in alloys or as a functional additive [8, 9].Cu bearing metals, such as Cu-bearing stainless steels and Cubearing titanium alloys, have been widely investigated for their antibacterial properties [10, 1 1]. The increase of copper content, within the limit ranges, has been proven to enhance the antimicrobial activity [12, 1 3]. However, the addition of copper in selective metallic materials might hamper the corrosion resistance and mechanical …
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影响因子:
2.9
作者:
Alhamlan, F. S.;Majumder, M. S.;BinSaeed, A.
通讯作者:
BinSaeed, A.
影响因子:
9.4
作者:
Chuang, Ming-Hao;Tsai, Ming-Hung;Yeh, Jien-Wei
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影响因子:
8.8
作者:
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通讯作者:
Sauter, Daniel
影响因子:
9.4
作者:
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通讯作者:
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影响因子:
4.9
作者:
Sagripanti, JL;Routson, LB;Lytle, CD
通讯作者:
Lytle, CD