Laser-Induced front Side Etching: An Easy and Fast Method for Sub-μm Structuring of Dielectrics
Laser-Induced front Side Etching: An Easy and Fast Method for Sub-μm Structuring of Dielectrics
复制标题
激光诱导正面蚀刻:一种简单快速的亚微米电介质结构方法
DOI:
10.1016/j.phpro.2012.10.071
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发表时间:
2012
期刊:
影响因子:
--
通讯作者:
K. Zimmer
中科院分区:
文献类型:
--
作者:
P. Lorenz;M. Ehrhardt;K. Zimmer
Laser-induced front side etching (LIFE) is a method for the nanometer-precision structuring of dielectrics, e.g. fused silica, using thin metallic as well as organic absorber layer attached to the laser-irradiated front side of the sample. As laser source an excimer laser with a wavelength of 248nm and an pulse duration of 25ns was used. For sub-μm patterning a phase mask illuminated by the top hat laser beam was projected by a Schwarzschild objective. The LIFE process allows the fabrication of well-defined and smooth surface structures with sub-μm lateral etching regions (Δx < 350nm) and vertical etching depths from 1nm to sub-mm.
DOI:
10.1002/pssa.201127672
发表时间:
2012
期刊:
physica status solidi (a)
影响因子:
--
作者:
P. Lorenz;M. Ehrhardt;K. Zimmer
通讯作者:
K. Zimmer