Interdiffusion and Atomic Mobilities in fcc Co-Ga and Co-V Alloys

Interdiffusion and Atomic Mobilities in fcc Co-Ga and Co-V Alloys
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面心立方 Co-Ga 和 Co-V 合金中的相互扩散和原子迁移率

DOI:
10.1007/s11669-017-0598-8
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发表时间:
2018-02
影响因子:
1.4
通讯作者:
Wang C. P.
Wang C. P.
中科院分区:
材料科学4区
文献类型:
--
作者:
Liu X. J.;Yu Y.;Lu Y.;Luo Y. S.;Han J. J.;Wang C. P.

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基于Co/Co-10 Ga、Co/Co-12 Ga和Co/Co-10 V(at.%)用den Broeder方法研究了1273 ~ 1573 K温度范围内Co-Ga和Co-V二元系面心立方(fcc)相的互扩散系数。基于现有的热力学信息,相互扩散数据进行了评估,开发的fcc Co-Ga和Co-V合金的原子迁移率使用DICTRA软件包,并通过模拟浓度-距离分布的有效性进行了测试。
On the basis of Co/Co-10Ga, Co/Co-12Ga, and Co/Co-10V (at.%) diffusion couples, interdiffusion coefficients in the face-centered cubic (fcc) phase of the Co-Ga and Co-V binary systems were investigated in the temperature range between 1273 and 1573 K by means of the den Broeder method. Based on available thermodynamic information, the interdiffusion data were assessed to develop the atomic mobilities for the fcc Co-Ga and Co-V alloys using the DICTRA software package, and their validity was tested by simulating concentration–distance profiles.
DOI: 10.1007/978-1-4684-6075-9
发表时间: 1970-03
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期刊: Scripta Materialia
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