Self-aligned Copper Oxide Passivation Layer — A Study on the Reliability Effect
Self-aligned Copper Oxide Passivation Layer — A Study on the Reliability Effect
复制标题
自对准氧化铜钝化层——可靠性效应研究
作者：
J. Su;Y. Kuo
采用电迁移应力法研究了自对准氧化铜钝化层等离子蚀刻铜线的可靠性。采用等离子体氧化法制备氧化钝化层，覆盖整个暴露的铜线，防止环境条件下铜线表面氧化。孔隙的形成和生长过程反映了断线机制。用光学显微镜观察晶界耗竭和晶粒变薄形成的空洞。测量了线路失效次数与线路宽度和电流密度的关系。氧化钝化层的加入，由于传热差和铜的扩散，缩短了寿命，加速了孔洞的形成和生长。窄线的寿命比宽线长，因为通量发散形成孔洞的晶界较少。氧化铜钝化层形成自对准铜线。它还吸收了从大块铜膜中扩散的铜原子。
The reliability of the plasma etched copper lines with the self-aligned copper oxide passivation layer has been studied with the electromigration stress method. The oxide passivation layer was prepared by plasma oxidation, which covers the entire exposed copper line to prevent the surface oxidation under the ambient condition. The void formation and growth process reflect the line broken mechanism. Voids formed from grain boundary depletion and grain thinning were monitored by optical microscopes. The line failure times with respect to line width and current density were measured. The addition of the oxide passivation layer shortened the lifetime due to the poor heat transfer and copper diffusion, which accelerated the formation and growth of the voids. The narrow line has a longer lifetime than the wide line because of the fewer grain boundaries for flux divergence to form voids. The copper oxide passivation layer was formed self-aligned to the copper line. It also gettered copper atoms diffused from the bulk copper film.
影响因子：
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作者：
Hu, Min;Novo, Carolina;Hartland, Gregory V.
通讯作者：
Hartland, Gregory V.
具有氧化铜覆盖层的等离子蚀刻铜线的电迁移研究
DOI：
10.1149/09703.0051ecst
发表时间：
2020
期刊：
ECS Transactions
影响因子：
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作者：
Su, Jia Quan;Kuo, Yue
通讯作者：
Kuo, Yue