Wood-Derived, Vertically Aligned, and Densely Interconnected 3D SiC Frameworks for Anisotropically Highly Thermoconductive Polymer Composites.
Wood-Derived, Vertically Aligned, and Densely Interconnected 3D SiC Frameworks for Anisotropically Highly Thermoconductive Polymer Composites.
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用于各向异性高导热聚合物复合材料的木材衍生、垂直排列和密集互连的 3D SiC 框架
DOI：
10.1002/advs.202103592
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发表时间：
2022-03
期刊：
影响因子：
--
通讯作者：
Yang J
中科院分区：
文献类型：
--
作者：
Zhou X;Xu S;Wang Z;Hao L;Shi Z;Zhao J;Zhang Q;Ishizaki K;Wang B;Yang J
Construction of a vertically aligned and densely interconnected ordered 3D filler framework in a polymer matrix is a challenge to attain significant thermal conductivity (TC) enhancement efficiency. Fortunately, many biomaterials with unique microstructures can be found in nature. With inspiration from wood, artificial composites can be rationally designed to achieve desired properties. Herein, the authors report a facile and effective approach to fabricate anisotropic polymer composites by biotemplate ceramization technology and subsequent vacuum impregnation of epoxy resin. The hierarchical microstructure of wood is perfectly replicated in the cellular biomass derived SiC (bioSiC) framework by carbothermal reduction. Owing to the anisotropic architecture of bioSiC, the epoxy composite with vertically aligned dense SiC microchannels shows interesting properties, including a high TC (10.27 W m−1K−1), a significant enhancement efficiency (259 per 1 vol% loading), an outstanding anisotropic TC ratio (5.77), an extremely low coefficient of linear thermal expansion (12.23 ppm K−1), a high flexural strength (222 MPa), and an excellent flame resistance. These results demonstrate that this approach is expected to open a new avenue for design and preparation of high performance thermal management materials to address the heat dissipation of modern electronics.
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