Flip chip assembly for cryogenics and flexible substrates
Flip chip assembly for cryogenics and flexible substrates
复制标题
用于低温和柔性基板的倒装芯片组装
DOI：
10.1109/nssmic.2015.7581890
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发表时间：
2015
期刊：
影响因子：
--
通讯作者：
K. Nishimura
中科院分区：
文献类型：
--
作者：
A. Tomada;J. Segal;J. Hasi;C. Kenney;K. Nishimura
许多基本粒子和核物理实验都是在低温下进行的。随着通道数和传感器密度的增加，对倒装芯片键合作为形成互连的方法的需求不断增长。考虑到经常涉及的不同材料，当系统冷却时粘结材料堆叠的差异收缩是主要问题。柔性衬底广泛应用于光子科学和粒子物理探测器的构造中。将柔性基板倒装芯片结合到刚性部件或其他柔性基板的能力可以是可行的，并且不是标准工艺。科学实验尤其如此，因为它们经常在极端温度或辐射环境中进行。
Many elementary-particle and nuclear physics experiments are performed at cryogenic temperatures. As channels counts and sensor densities increase there is a growing need for flip-chip bonding as a method for forming interconnections. Given the disparate materials that are often involved, differential contraction of the bonded material stack as the system cools is a major concern. Flexible substrates are widely used in the construction of photon science and particle physics detectors. The ability to flip-chip bond flexible substrates to rigid parts or other flexible substrates can be enabling and is not a standard process. This is particularly true for science experiments, which often operate in extreme temperature or radiation environments.
影响因子：
38.3
作者：
Liu J;Fu TM;Cheng Z;Hong G;Zhou T;Jin L;Duvvuri M;Jiang Z;Kruskal P;Xie C;Suo Z;Fang Y;Lieber CM
通讯作者：
Lieber CM