Tunable thermal expansion in zinc-bonded composites: Zn/Si/Zn0.75Sn0.2Mn0.05NMn3
Tunable thermal expansion in zinc-bonded composites: Zn/Si/Zn0.75Sn0.2Mn0.05NMn3
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锌复合材料的可调热膨胀：Zn/Si/Zn0.75Sn0.2Mn0.05NMn3
DOI：
10.1016/j.scriptamat.2019.10.031
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发表时间：
2020-03
影响因子：
6
通讯作者：
Yuping Sun
中科院分区：
文献类型：
--
作者：
Zicheng Wang;Jianchao Lin;Peng Tong;Mingguang Kong;Xuekai Zhang;Cheng Yang;Wenhai Song;Yuping Sun
Negative thermal expansion (NTE) materials can compensate for the coefficient of thermal expansion (CTE) of normal metals. Currently, it is challenging to prepare NTE/metal composites facing the practical demands. We report the tunable CTEs between –0.39 and 6.19 ppm/K around room temperature in Zn/Si/Zn0.75Sn0.2Mn0.05NMn3composites. The low-melting Zn acts as the adhesive, while Zn0.75Sn0.2Mn0.05NMn3is the CTE compensator. Moreover, the composites have high compression strength (225 MPa) and thermal conductivity (52 W/K m), showing great potentials as electronic thermal management materials. Our results suggest an effective way to realize low-CTE composites with excellent performance based on NTE compounds.
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