Analysis of Residual Thermal Stress in CVD-W Coating as Plasma Facing Material
Analysis of Residual Thermal Stress in CVD-W Coating as Plasma Facing Material
复制标题
CVD-W 涂层作为等离子体表面材料的残余热应力分析
DOI：
10.1088/1009-0630/14/7/20
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发表时间：
2012-01
影响因子：
1.7
通讯作者：
Fang Qianfeng
中科院分区：
文献类型：
--
作者：
Wang Kun;Wang Xianping;Chen Junling;Fang Qianfeng
化学气相沉积-钨（CVD-W）涂层覆盖等离子体面向组件（PFC）表面是实现钨材料作为等离子体面向材料（PFM）在聚变装置中的有效方法。利用有限元方法（ANSYS 10.0）成功模拟了涂层与基体热失配导致的CVD-W涂层残余热应力。为了描述CVD-W涂层-衬底体系的残余热应力，研究了涂层厚度、沉积温度、层间等沉积参数对CVD-W涂层-衬底体系的影响。针对CVD-W涂层作为PFM的应用，分析了基体材料对CVD-W涂层残余热应力产生的影响。这对CVD-W涂层的制备和应用具有一定的指导意义。
Chemical vapor deposition-tungsten (CVD-W) coating covering the surface of the plasma facing component (PFC) is an effective method to implement the tungsten material as plasma facing material (PFM) in fusion devices. Residual thermal stress in CVD-W coating due to thermal mismatch between coating and substrate was successfully simulated by using a finite element method (ANSYS 10.0 code). The deposition parametric effects, i.e., coating thickness and deposition temperature, and interlayer were investigated to get a description of the residual thermal stress in the CVD-W coating-substrate system. And the influence of the substrate materials on the generation of residual thermal stress in the CVD-W coating was analyzed with respect to the CVD-W coating application as PFM. This analysis is beneficial for the preparation and application of CVD-W coating.
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影响因子：
3.1
作者：
N. Yoshida
通讯作者：
N. Yoshida
影响因子：
2.1
作者：
X. C. Zhang;Bin-shi Xu;Haiqian Wang;Yanbin Jiang;Y. X. Wu
通讯作者：
X. C. Zhang;Bin-shi Xu;Haiqian Wang;Yanbin Jiang;Y. X. Wu
影响因子：
3.1
作者：
S. Tamura;K. Tokunaga;N. Yoshida
通讯作者：
S. Tamura;K. Tokunaga;N. Yoshida
影响因子：
1.7
作者：
Zhangjian Zhou;S. Song;W. Yao;G. Pintsuk;J. Linke;Shuang-quan Guo;C. Ge
通讯作者：
Zhangjian Zhou;S. Song;W. Yao;G. Pintsuk;J. Linke;Shuang-quan Guo;C. Ge
影响因子：
4
作者：
T. Liu;H. Pinto;P. Brito;L. A. Sales;D. Raabe
通讯作者：
T. Liu;H. Pinto;P. Brito;L. A. Sales;D. Raabe