Energy absorption material using buckling strength of shape memory alloy plate
Energy absorption material using buckling strength of shape memory alloy plate
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利用形状记忆合金板的屈曲强度的能量吸收材料
DOI：
10.1117/12.539501
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发表时间：
2004
期刊：
影响因子：
9.4
通讯作者：
M. Taya
中科院分区：
文献类型：
--
作者：
Shunji Suzuki;Y. Urushiyama;M. Taya
为了将TiNi作为能量吸收材料，对TiNi形状记忆合金（SMA）板的屈曲行为进行了数值模拟和实验研究。为此，我们进行了有限元分析，几个厚度和长度的TiNi板。目前的分析研究表明，使用TiNi作为EA材料的有前途的结果。实验工作证实了这一点。后屈曲形状和载荷-位移关系与传统材料如铝和钢有很大不同。常规材料的屈曲后强度随载荷（或变形）的增加而逐渐降低。在较高载荷下的承载能力降低归因于压缩下变形样本中的局部高应变，而大部分样本体积在适度应变下变形。如果避免这种局部高应变，并且在压缩载荷下可以在整个试样中更均匀地产生高应变，则这种板有望表现出大的能量吸收，即新的EA材料。研究表明，在相同的压缩载荷水平下，TiNi板在压缩下的能量吸收是铝板的3倍。
The buckling behavior of TiNi Shape Memory Alloy (SMA) plates is evaluated numerically and experimentally with aim of using TiNi as an Energy Absorption (EA) material. To this end, we performed FEM analysis for TiNi plates of several thickness and length. The present analytical study shows promising result of using TiNi as an EA material. This is confirmed by the experiment work. The post-buckling shape and the load-displacement relationship are quite different from those of conventional materials such as aluminum and steel. Post-buckling strength of the conventional materials decreases gradually with increase in applied loading (or deformation). This reduction in the load bearing capacity at higher loads is attributed to the localized high strain in deformed specimen under compression while the majority of the specimen volume deform at modest strain. If this localized high strain is avoided and high straining can be made more uniformly in the entire specimen under compression load, then such a plate is expected to exhibit large energy absorption, i.e. a new EA material. The present study reveals that the energy absorption in TiNi plate under compression is 3 times larger than that of aluminum plate for the same level of compression loading.
DOI：
10.1177/104538901400438019
发表时间：
2001-11
影响因子：
2.7
作者：
T. Takagi;Yun Luo;Shunji Suzuki;M. Matsumoto;J. Tani
通讯作者：
T. Takagi;Yun Luo;Shunji Suzuki;M. Matsumoto;J. Tani