Two types of natural graphite host matrix for composite activated carbon adsorbents
Two types of natural graphite host matrix for composite activated carbon adsorbents
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用于复合活性炭吸附剂的两种天然石墨基质
DOI:
10.1016/j.applthermaleng.2011.07.011
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发表时间:
2013-02
期刊:
影响因子:
--
通讯作者:
Critoph, R.E.
中科院分区:
文献类型:
--
作者:
Metcalf, S.J.;Thorpe, R.;Tamainot-Telto, Z.;Wang, L.W.;Critoph, R.E.
Two types of host for activated carbon (AC) adsorbents intended for use in compressed systems are studied: expanded natural graphite (ENG) and expanded natural graphite treated with acid (ENG-TA). Results show that compressed ENG-TA has much higher thermal conductivity than the compressed ENG. For a density of 830 kg/m3the thermal conductivity of compressed ENG-TA is 336 W/(mK), and it is of the order of one hundred times higher compared with compressed ENG having similar density. The permeability of compressed ENG-TA is much more critical than the compressed ENG. For example for similar density of 300 kg/m3, the permeability of compressed ENG-TA is 2.01 × 10−15m2while the permeability of compressed ENG is 1.07 × 10−13m2. Compressed composite adsorbents of AC with ENG as host were produced with a high density in the range 700–720 kg/m3. Considering that the permeability will be too low using composite AC with ENG-TA as host in high density, the density range was restricted to less than 500 kg/m3. The thermal conductivity of AC/ENG-TA composite is much higher than the thermal conductivity of AC/ENG composite, and it is about 7 times higher than the optimal value of AC/ENG composite.
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影响因子:
29.5
作者:
Ruzhu Wang;R. G. Oliveira
通讯作者:
Ruzhu Wang;R. G. Oliveira
影响因子:
6.4
作者:
Z. Tamainot-Telto;R. E. Critoph
通讯作者:
Z. Tamainot-Telto;R. E. Critoph
DOI:
10.1016/0890-4332(93)90014-m
发表时间:
1993-05
期刊:
Heat Recovery Systems and Chp
影响因子:
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作者:
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通讯作者:
P. Neveu;J. Castaing
影响因子:
6.4
作者:
Wang, R. Z.;Critoph, R. E.;Tamainot-Telto, Z.;Metcalf, S. J.;Wang, L. W.
通讯作者:
Wang, L. W.
影响因子:
6.4
作者:
L.W Wang;J.Y Wu;R.Z Wang;Y.X Xu;S.G Wang;X.R Li
通讯作者:
L.W Wang;J.Y Wu;R.Z Wang;Y.X Xu;S.G Wang;X.R Li