Mass Transfer Limited KOH Etching in Crystalline Silicon using a Confinement Mask
Mass Transfer Limited KOH Etching in Crystalline Silicon using a Confinement Mask
复制标题
使用限制掩模对晶体硅进行传质限制 KOH 蚀刻
DOI:
10.1149/2162-8777/ab8063
复制
发表时间:
2020
影响因子:
2.2
通讯作者:
Schunk, P. Randall
中科院分区:
文献类型:
--
作者:
Tjiptowidjojo, Kristianto;Han, Seok Jun;Han, Sang Eon;Han, Sang M.;Schunk, P. Randall
We demonstrate the use of a confinement mask to control the etch depth gradient in nanopatterned crystalline silicon. The gradient is set by controlling the clearance gap of the mask. We also develop a wafer-scale model that accounts for etchant transport, flow, and surface reaction in order to predict etch depth profiles for two different masks. Results from the model reveal that the gradient is best achieved by varying the clearance between nanometer and micrometer scale in a periodic fashion. The results are qualitatively validated with experimental demonstration and observation.
登录
查看更多内容
DOI:
--
发表时间:
1988
期刊:
影响因子:
--
作者:
R. Alkire;H. Deligianni
通讯作者:
H. Deligianni
影响因子:
2.4
作者:
Safaa Hassan;David Lowell;M. Adewole;D. George;Hualiang Zhang;Yuankun Lin
通讯作者:
Safaa Hassan;David Lowell;M. Adewole;D. George;Hualiang Zhang;Yuankun Lin
影响因子:
3.9
作者:
Kulkarni, MS;Erk, HF
通讯作者:
Erk, HF
DOI:
--
发表时间:
2015
期刊:
影响因子:
--
作者:
M. Branham;W. Hsu;S. Yerci;J. Loomis;S. Boriskina;Brittany R. Hoard;S. Han;Gang Chen
通讯作者:
Gang Chen
DOI:
--
发表时间:
--
期刊:
--
影响因子:
--
作者:
V. Ferry;M. Verschuuren;Hongbo B T Li;E. Verhagen;R. Walters;R. Schropp;H. Atwater;A. Polman
通讯作者:
V. Ferry;M. Verschuuren;Hongbo B T Li;E. Verhagen;R. Walters;R. Schropp;H. Atwater;A. Polman